DocumentCode
114674
Title
Objective
fYear
2014
fDate
27-29 Aug. 2014
Abstract
The following topics are dealt with: MEMS-NEMS; device modeling & simulation; nanoelectronics; device physics and characterization; opto-electronics and photonics technology; microwave device and MMIC; IC packaging and testing; reliability and failure analysis; semiconductor manufacturing & process; microelectronics application in product development; process technology; and electronics materials and device fabrication.
Keywords
MMIC; failure analysis; integrated circuit packaging; integrated circuit testing; integrated optics; micromechanical devices; nanoelectromechanical devices; nanoelectronics; optoelectronic devices; product development; reliability; semiconductor device manufacture; IC packaging; IC testing; MEMS-NEMS; MMIC; device characterization; device fabrication; device modeling; device physics; device simulation; electronics materials; failure analysis; microelectronics application; microwave device; nanoelectronics; opto-electronics; photonics technology; process technology; product development; reliability; semiconductor manufacturing; semiconductor process;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Electronics (ICSE), 2014 IEEE International Conference on
Conference_Location
Kuala Lumpur
Type
conf
DOI
10.1109/SMELEC.2014.6920772
Filename
6920772
Link To Document