DocumentCode :
114716
Title :
The RF power effect on the surface morphology of titanium dioxide (TiO2) film
Author :
Norhafiezah, S. ; Ayub, R. Mat ; Arshad, M. K. Md ; Azman, A.H. ; Fatin, M.F. ; Farehanim, M.A. ; Hashim, U.
Author_Institution :
Inst. of Nano Electron. Eng. (INEE), Univ. Malaysia Perlis (UniMAP), Kangar, Malaysia
fYear :
2014
fDate :
27-29 Aug. 2014
Firstpage :
48
Lastpage :
51
Abstract :
In this paper, we present the influence of deposition process parameter on the morphological properties of titanium dioxide (TiO2). Thin film of TiO2 was deposited on Si (100) substrate using the reactive Radio Frequency (RF) sputtering technique with different RF power. The XRD analysis showed that only Anatase structure was obtained during low RF power deposition, while both; Anatase and Rutile structure were obtained at high RF power. It was also observed that when the RF power is increased from 100W to 300W, the surface roughness and the particle size of the TiO2 film measured by using AFM were shown to be decreased from 0.39 to 0.25nm and 68.3 to 59.6nm respectively. Consequently, the diffuse transmittance measured using UV-vis spectroscopy shown degradation of transmittance percentage from 85% to 60% and the Eg also reduce from 3.24eV to 2.55eV. Moreover, the small particle size with the acceptable surface roughness, the less percentage of transmittance and the reduction of the band gap were successfully achieved.
Keywords :
X-ray diffraction; atomic force microscopy; infrared spectra; particle size; semiconductor materials; semiconductor thin films; sputter deposition; surface morphology; surface roughness; titanium compounds; ultraviolet spectra; AFM; RF power effect; Si (100) substrate; TiO2-Si; UV-vis spectroscopy; XRD analysis; anatase structure; band gap; deposition parameter effects; diffuse transmittance spectra; morphological properties; particle size; power 100 W to 300 W; radio frequency sputtering method; rutile structure; surface morphology; surface roughness; titanium dioxide film; transmittance percentage degradation; Films; Radio frequency; Sputtering; Substrates; Surface morphology; Surface treatment; Titanium; Deposition parameter effects; RF power; Reactive RF sputtering; TiO2 thin film;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Electronics (ICSE), 2014 IEEE International Conference on
Conference_Location :
Kuala Lumpur
Type :
conf
DOI :
10.1109/SMELEC.2014.6920792
Filename :
6920792
Link To Document :
بازگشت