• DocumentCode
    114718
  • Title

    Development of a silicon carbide MEMS capacitive pressure sensor operating at 500 °C

  • Author

    Marsi, Noraini ; Majlis, Burhanuddin Yeop ; Hamzah, Azrul Azlan ; Abidin, Ummikalsom ; Mohd-Yasin, Faisal

  • Author_Institution
    Inst. Microeng. & Nanoelectron. (IMEN), Univ. Kebangsaan Malaysia, Bangi, Malaysia
  • fYear
    2014
  • fDate
    27-29 Aug. 2014
  • Firstpage
    52
  • Lastpage
    55
  • Abstract
    In this paper, we present development of MEMS capacitive pressure sensor based silicon carbide (3C-SiC) materials. The sensor is made up of four elements: a 3C-SiC diaphragm, silicon substrate, a reliable stainless steel (SS) o-ring and (SS) vacuum clamper as the package. The designed are inherent simplicity and ruggedness of this physical configuration that acceptably performed for extreme environment applications such as in gas turbine engine. This study reported a reliability testing of a prototype package MEMS capacitive pressure sensor verified up to 500 °C through high temperature lab testing. At 500 °C, the reliability test results show that the sensitivity of 0.826 pF/MPa is achieved. Experimentally, sensor nonlinearity of 0.61 % is found with hysteresis of 3.13 %. The maximum temperature coefficient of output change is 0.073 %/°C measured at 5 MPa.
  • Keywords
    capacitive sensors; electronics packaging; microfabrication; microsensors; pressure sensors; reliability; silicon compounds; temperature measurement; temperature sensors; wide band gap semiconductors; MEMS capacitive pressure sensor; SiC; diaphragm; gas turbine engine; high temperature lab testing; maximum temperature coefficient; o-ring; packaging; pressure 5 MPa; reliability testing; silicon substrate; stainless steel; temperature 500 degC; temperature measurement; vacuum clamper; Fabrication; Micromechanical devices; Silicon; Silicon compounds; Substrates; Temperature measurement; Temperature sensors; MEMS; hysteresis; pressure sensor; sensitivity; silicon carbide;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Electronics (ICSE), 2014 IEEE International Conference on
  • Conference_Location
    Kuala Lumpur
  • Type

    conf

  • DOI
    10.1109/SMELEC.2014.6920793
  • Filename
    6920793