DocumentCode :
1147184
Title :
The lowdown on high-rise chips
Author :
Lawton, George
Volume :
37
Issue :
10
fYear :
2004
Firstpage :
24
Lastpage :
27
Abstract :
As today´s silicon technology reaches its technical limits in many areas, developers are looking for new ways to design better chips. Typically, they look for ways to make chips faster, more energy efficient, and cost-effective, while still using current fabrication techniques and materials. In light of this, companies are working on high-rise, multilayer chips. Instead of laying out the vast majority of a chips´ circuitry on a single layer of silicon, they are making chips with circuitry arranged vertically as well as horizontally.
Keywords :
integrated circuit design; logic design; microprocessor chips; monolithic integrated circuits; printed circuits; chip circuitry; cost-effective chips; energy efficient chips; fabrication techniques; high-rise multilayer chip design; silicon technology; Bonding; Clocks; Computer displays; Delay; Integrated circuit interconnections; Liquid crystal displays; Random access memory; Silicon; Substrates; Wire;
fLanguage :
English
Journal_Title :
Computer
Publisher :
ieee
ISSN :
0018-9162
Type :
jour
DOI :
10.1109/MC.2004.179
Filename :
1350722
Link To Document :
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