DocumentCode
1147184
Title
The lowdown on high-rise chips
Author
Lawton, George
Volume
37
Issue
10
fYear
2004
Firstpage
24
Lastpage
27
Abstract
As today´s silicon technology reaches its technical limits in many areas, developers are looking for new ways to design better chips. Typically, they look for ways to make chips faster, more energy efficient, and cost-effective, while still using current fabrication techniques and materials. In light of this, companies are working on high-rise, multilayer chips. Instead of laying out the vast majority of a chips´ circuitry on a single layer of silicon, they are making chips with circuitry arranged vertically as well as horizontally.
Keywords
integrated circuit design; logic design; microprocessor chips; monolithic integrated circuits; printed circuits; chip circuitry; cost-effective chips; energy efficient chips; fabrication techniques; high-rise multilayer chip design; silicon technology; Bonding; Clocks; Computer displays; Delay; Integrated circuit interconnections; Liquid crystal displays; Random access memory; Silicon; Substrates; Wire;
fLanguage
English
Journal_Title
Computer
Publisher
ieee
ISSN
0018-9162
Type
jour
DOI
10.1109/MC.2004.179
Filename
1350722
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