• DocumentCode
    1147184
  • Title

    The lowdown on high-rise chips

  • Author

    Lawton, George

  • Volume
    37
  • Issue
    10
  • fYear
    2004
  • Firstpage
    24
  • Lastpage
    27
  • Abstract
    As today´s silicon technology reaches its technical limits in many areas, developers are looking for new ways to design better chips. Typically, they look for ways to make chips faster, more energy efficient, and cost-effective, while still using current fabrication techniques and materials. In light of this, companies are working on high-rise, multilayer chips. Instead of laying out the vast majority of a chips´ circuitry on a single layer of silicon, they are making chips with circuitry arranged vertically as well as horizontally.
  • Keywords
    integrated circuit design; logic design; microprocessor chips; monolithic integrated circuits; printed circuits; chip circuitry; cost-effective chips; energy efficient chips; fabrication techniques; high-rise multilayer chip design; silicon technology; Bonding; Clocks; Computer displays; Delay; Integrated circuit interconnections; Liquid crystal displays; Random access memory; Silicon; Substrates; Wire;
  • fLanguage
    English
  • Journal_Title
    Computer
  • Publisher
    ieee
  • ISSN
    0018-9162
  • Type

    jour

  • DOI
    10.1109/MC.2004.179
  • Filename
    1350722