• DocumentCode
    114721
  • Title

    Design of a 4-bit adder using reversible logic in quantum-dot cellular automata (QCA)

  • Author

    Kunalan, Darushini ; Cheong, Chee Lee ; Chau, Chien Fat ; Bin Ghazali, Azrul

  • Author_Institution
    Center for Micro & Nano Eng. (CeMNE), Univ. Tenaga Nasional, Kajang, Malaysia
  • fYear
    2014
  • fDate
    27-29 Aug. 2014
  • Firstpage
    60
  • Lastpage
    63
  • Abstract
    Both quantum-dot cellular automata (QCA) and reversible logic are emerging technologies that are promising alternatives to overcoming the scaling and heat dissipation issues, respectively, in the current CMOS designs. Here, the fundamentals of QCA and reversible logic are studied; the feasibility of incorporating reversible logic in QCA designs is also demonstrated. Based on two existing designs, an improved version of the reversible gates, namely the Feynman Gate and the Toffoli Gate, were implemented in QCA technology using QCADesigner. The proposed design of the QCA-based Feynman Gate is faster by ½ cycle as compared to the existing design; while the proposed Toffoli Gate has the same latency as the existing design but it is readily to be cascaded into a more complex design. A 4-bit ripple carry adder in QCA is then designed using the proposed Feynman and Toffoli gates to realize a reversible QCA full adder. This 4-bit QCA adder with reversible logic consists of 2030 QCA cells, has a latency of 7 clock cycles and 8 garbage outputs.
  • Keywords
    adders; cellular automata; logic design; logic gates; quantum dots; CMOS designs; Feynman gate; QCA designs; Toffoli gate; heat dissipation; quantum-dot cellular automata; reversible QCA full adder; reversible gates; reversible logic; ripple carry adder design; word length 4 bit; Adders; Automata; Clocks; Heating; Logic gates; Quantum dots; Wires; Adder; Feynman; Ripple Carry; Toffoli; quantum-dot cellular automata; reversible logic;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Electronics (ICSE), 2014 IEEE International Conference on
  • Conference_Location
    Kuala Lumpur
  • Type

    conf

  • DOI
    10.1109/SMELEC.2014.6920795
  • Filename
    6920795