Title :
On-Chip Coupled Transmission Line Modeling for Millimeter-Wave Applications Using Four-Port Measurements
Author :
Kang, Kai ; Brinkhoff, James ; Shi, Jinglin ; Lin, Fujiang
Author_Institution :
Inst. of Microelectron., A*STAR, Singapore, Singapore
Abstract :
Transmission lines are fundamental elements in millimeter-wave circuits. In this paper, on-chip coupled transmission lines, fabricated in a commercial 0.18 ??m complementary metal-oxide semiconductor process, have been modeled, based on measured 50 GHz four-port scattering-parameters. The two-port open-short deembedding technique and thru deembedding method were successfully extended and applied to the four-port structures presented here. The accuracy of the deembedding techniques was verified by full-wave electromagnetic simulation. Based on the deembedded S-parameters, a SPICE-compatible equivalent circuit model of on-chip coupled transmission lines was extracted. Simulation and measurement results agree well over the entire frequency band from 100 MHz up to 50 GHz.
Keywords :
MIS devices; S-parameters; SPICE; coupled transmission lines; equivalent circuits; millimetre wave devices; S-parameters; SPICE-compatible equivalent circuit model; four-port measurements; four-port scattering-parameters; frequency 100 MHz to 50 GHz; full-wave electromagnetic simulation; metal-oxide semiconductor process; millimeter-wave applications; onchip coupled transmission line modeling; two-port open-short deembedding technique; Complementary metal–oxide semiconductor (CMOS); coupled transmission lines; equivalent circuit model; four-port deembedding; on-chip measurements;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/TADVP.2009.2024212
