Title :
Bonding stress analysis on Palladium bond pad between Cu and Au FAB
Author :
Sauli, Zaliman ; Retnasamy, Vithyacharan ; Mamat, H.
Author_Institution :
Sch. of Microelectron. Eng., Univ. Malaysia Perlis (UniMAP), Arau, Malaysia
Abstract :
This papers presents the simulation investigation of bond pad stress analysis during wire bonding contact stage. The contact of gold free air ball (FAB) and copper (FAB) on Palladium (Pd) bond pad were evaluated through simulation. The stress of wire FAB, Pd bond pad and copper lead frame during FAB contact were compared for both wire materials. Ansys 11 was used for the analysis. Outcome of the analysis exhibited that the contact force significantly influences the stress on the FAB, bond pad and lead frame. FAB wire material comparison showed that the stress of Cu wire FAB was larger compared to the Gold FAB.
Keywords :
copper; gold; lead bonding; palladium; semiconductor process modelling; stress analysis; Ansys 11; Au; Cu; FAB; Pd; bonding stress analysis; contact force; copper FAB; gold free air ball; lead frame; palladium bond pad; wire bonding contact stage; wire material; Bonding; Copper; Gold; Materials; Stress; Wires; Ansys; Copper FAB; Gold FAB; Pd bond pad; contact stage;
Conference_Titel :
Semiconductor Electronics (ICSE), 2014 IEEE International Conference on
Conference_Location :
Kuala Lumpur
DOI :
10.1109/SMELEC.2014.6920811
