Title :
Fabrication of interdigitated microelectrodes for CuO nanowires I-V measurement
Author :
Tiong Teck Yaw ; Chang Fu Dee ; Hamzah, Azrul Azlan ; Majlis, Burhanuddin Yeop ; Salleh, Mustapha Mohd ; Faizal, Mohd ; Rahman, Shah Atiqur
Author_Institution :
Inst. of Microengineeering & Nanoelectron., Univ. Kebangsaan Malaysia, Bangi, Malaysia
Abstract :
An interdigitated electrode consisted of 50 pairs of 5 μm wide microelectrodes, separated by 5 μm gap has been fabricated using single layer positive photoresist lift-off process. The effect of UV exposure time to electrode width and photoresist overcut angle were optimized for the fabrication of an array interdigitated electrodes. The fabricated interdigitated electrode has been used to measure the electrical properties of thick film and nanowires sample. The Cu2O film and CuO nanowires have been contacted on the aluminium interdigitated electrode through the joule heating technique. Schottky behaviour based I-V characteristics of both Cu2O film and CuO nanowires were observed at room temperature. The formation of Schottky barrier on the sample has been discussed.
Keywords :
Schottky barriers; copper compounds; microelectrodes; microfabrication; microsensors; nanofabrication; nanolithography; nanosensors; nanowires; photoresists; thick film sensors; ultraviolet lithography; Cu2O; CuO; Schottky barrier; Schottky behaviour based I-V characteristics; UV exposure time effect; array interdigitated electrodes; electrical property measurement; interdigitated microelectrode fabrication; joule heating technique; nanowire sample; nanowires I-V measurement; photoresist lift-off process; photoresist overcut angle optimization; size 5 mum; thick film; Aluminum; Electrodes; Fabrication; Nanowires; Resists; Scanning electron microscopy; Sensors; Cu2O; CuO; Interdigitated microelectrodes; Nanowires; Photolithography;
Conference_Titel :
Semiconductor Electronics (ICSE), 2014 IEEE International Conference on
Conference_Location :
Kuala Lumpur
DOI :
10.1109/SMELEC.2014.6920829
