DocumentCode :
1148054
Title :
A new 4H-SiC normally off lateral channel vertical JFET with extremely low power losses: source inserted double-gate structure with a supplementary highly doped region
Author :
Choi, Young Chul ; Cha, Ho-Young ; Eastman, Lester F. ; Spencer, Michael G.
Author_Institution :
Sch. of Electr. & Comput. Eng., Cornell Univ., Ithaca, NY, USA
Volume :
52
Issue :
9
fYear :
2005
Firstpage :
1940
Lastpage :
1948
Abstract :
A novel silicon carbide (SiC) normally off lateral channel vertical junction field-effect transistor (LC-VJFET), namely a source-inserted double-gate structure with a supplementary highly doped region (SHDR), was proposed for achieving extremely low power losses in high-power switching applications. The proposed architecture was based on the combination of an additional source electrode inserted between two adjacent surface gate electrodes and a unique SHDR in the vertical channel region. Two-dimensional numerical simulations for the static and resistive switching characteristics were performed to analyze and optimize the SiC LC-VJFET structures for this purpose. Based on the simulation results, the excellent performance of the proposed structure was compared with optimized conventional structures with regard to total power losses. Finally, the proposed structure showed about a 20% reduction in on-state loss (Pon) compared to the conventional structures, due to the effective suppression of the JFET effect. Furthermore, the switching loss (Psw) of the proposed structure was found to be much lower than the results of the conventional structures, about a 75% ∼ 95% reduction, by significantly reducing both input capacitance (Ciss) and reverse transfer capacitance (Crss) of the device.
Keywords :
circuit simulation; field effect transistor switches; junction gate field effect transistors; power field effect transistors; power semiconductor switches; silicon compounds; wide band gap semiconductors; C; H; H-SiC; Si; SiC; extremely low power losses; high-power switching; normally off lateral channel vertical JFET; resistive switching; silicon carbide; source electrode; source inserted double-gate structure; static switching; supplementary highly doped region; surface gate electrodes; two-dimensional numerical simulations; vertical junction field-effect transistor; Capacitance; Electric breakdown; Electrodes; FETs; Insertion loss; Performance analysis; Silicon carbide; Switching frequency; Switching loss; Thermal conductivity; Numerical simulation; power loss; silicon carbide; vertical junction field-effect transistor (VJFET);
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2005.854278
Filename :
1499078
Link To Document :
بازگشت