• DocumentCode
    114821
  • Title

    Corner compensation mask design on (MEMS) accelerometer structure

  • Author

    Yusof, Noradila ; Noorakma, Abdullah C. W. ; Soin, Norhayati

  • Author_Institution
    Fac. of Design Arts & Eng. Technol., Univ. Sultan Zainal Abidin, Kuala Terengganu, Malaysia
  • fYear
    2014
  • fDate
    27-29 Aug. 2014
  • Firstpage
    248
  • Lastpage
    251
  • Abstract
    This paper presents the analysis effect of etching temperature and KOH concentration on convex corner undercutting of (MEMS) accelerometer structure. The Intellisuite CAD simulation software was used for the simulation analysis. From the analysis it was found that the optimum etching condition for this convex corner was at 25 wt% KOH concentration and 63 °C etching temperature. Different types of compensation mask corners were designed which are corner, square and triangle in order to study the undercutting phenomena. In this case, the square corner compensation mask was chosen as it shown the most suitable compensation mask for this design of accelerometer. The etching simulation was continued with square corner compensation mask etched in the optimized temperature and KOH concentration and it indicated that the square corner compensation mask is the most suitable mask to solve the convex corner undercutting for this accelerometer structure.
  • Keywords
    accelerometers; compensation; computerised instrumentation; etching; masks; microsensors; technology CAD (electronics); Intellisuite CAD simulation software; KOH concentration; MEMS accelerometer structure; convex corner undercutting phenomena; etching temperature analysis effect; square corner compensation mask design; temperature 63 degC; Accelerometers; Micromechanical devices; Semiconductor device modeling; Silicon; Solid modeling; Wet etching; Accelerometer; Compensation mask; Convex Corner Undercutting; Etching; Intellisuite CAD simulation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Electronics (ICSE), 2014 IEEE International Conference on
  • Conference_Location
    Kuala Lumpur
  • Type

    conf

  • DOI
    10.1109/SMELEC.2014.6920843
  • Filename
    6920843