DocumentCode :
114821
Title :
Corner compensation mask design on (MEMS) accelerometer structure
Author :
Yusof, Noradila ; Noorakma, Abdullah C. W. ; Soin, Norhayati
Author_Institution :
Fac. of Design Arts & Eng. Technol., Univ. Sultan Zainal Abidin, Kuala Terengganu, Malaysia
fYear :
2014
fDate :
27-29 Aug. 2014
Firstpage :
248
Lastpage :
251
Abstract :
This paper presents the analysis effect of etching temperature and KOH concentration on convex corner undercutting of (MEMS) accelerometer structure. The Intellisuite CAD simulation software was used for the simulation analysis. From the analysis it was found that the optimum etching condition for this convex corner was at 25 wt% KOH concentration and 63 °C etching temperature. Different types of compensation mask corners were designed which are corner, square and triangle in order to study the undercutting phenomena. In this case, the square corner compensation mask was chosen as it shown the most suitable compensation mask for this design of accelerometer. The etching simulation was continued with square corner compensation mask etched in the optimized temperature and KOH concentration and it indicated that the square corner compensation mask is the most suitable mask to solve the convex corner undercutting for this accelerometer structure.
Keywords :
accelerometers; compensation; computerised instrumentation; etching; masks; microsensors; technology CAD (electronics); Intellisuite CAD simulation software; KOH concentration; MEMS accelerometer structure; convex corner undercutting phenomena; etching temperature analysis effect; square corner compensation mask design; temperature 63 degC; Accelerometers; Micromechanical devices; Semiconductor device modeling; Silicon; Solid modeling; Wet etching; Accelerometer; Compensation mask; Convex Corner Undercutting; Etching; Intellisuite CAD simulation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Electronics (ICSE), 2014 IEEE International Conference on
Conference_Location :
Kuala Lumpur
Type :
conf
DOI :
10.1109/SMELEC.2014.6920843
Filename :
6920843
Link To Document :
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