Performance of thin-film chip resistors

Author

Bos, Larry

Author_Institution

Int. Resistive Co., Corpus Christi, TX, USA

Volume

17

Issue

3

fYear

1994

fDate

9/1/1994 12:00:00 AM

Firstpage

359

Lastpage

365

Abstract

Increased use of thin-film surface mount chip resisters in military and high-performance industrial equipment has led to an increased awareness of potential failure modes in harsh environments. In this work, we have studied the behavior of chip resistors fabricated from tantalum nitride and nichrome metal films under biased humidity and have measured widely different results attributable to the metal film, and protective system. The effects of electrostatic discharge (ESD) and high-temperature stability on these small resistive devices was also examined and related to the resistor design

Keywords

chromium alloys; electron device testing; electrostatic discharge; humidity; nickel alloys; stability; surface mount technology; tantalum compounds; thin film resistors; ESD; NiCr; SMD; TaN; biased humidity; electrostatic discharge; failure modes; harsh environments; high-temperature stability; metal film; protective system; resistor design; surface mount chip resisters; thin-film chip resistors; Defense industry; Electrostatic discharge; Electrostatic measurements; Humidity measurement; Military equipment; Protection; Resistors; Semiconductor device measurement; Stability; Transistors;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on

Publisher

ieee

ISSN

1070-9886

Type

jour

DOI

10.1109/95.311744

Filename

311744