• DocumentCode
    114916
  • Title

    Integrated constant voltage constant current readout interfacing circuit for EGFET electrochemical sensing

  • Author

    Guliga, H. ; Abdullah, Wan Fazlida Hanim ; Herman, Sukreen Hana

  • Author_Institution
    Fac. of Electr. Eng., Univ. Teknol. MARA, Shah Alam, Malaysia
  • fYear
    2014
  • fDate
    27-29 Aug. 2014
  • Firstpage
    440
  • Lastpage
    443
  • Abstract
    Integrated constant voltage constant current (CVCC) readout interfacing for EGFET electrochemical sensing is presented. Development of integrated CVCC readout circuit is lead to single chip smart sensor system with the low cost production. CVCC technique is commonly used in investigation of ionic activities solution. The design architecture of CVCC has been targeted to Silterra 0.13um technology with the size of area include the IO pads design is 873μm × 811μm. the functionality of sub modules in this design included the three stage operational amplifier, current source and voltage reference circuit have been proved via the simulation results. Furthermore, the minimum input voltage from the ion sensing membrane for this readout circuit is approximately 0.73V.
  • Keywords
    constant current sources; electric current measurement; electrochemical sensors; field effect transistors; intelligent sensors; membranes; operational amplifiers; readout electronics; reference circuits; CVCC readout circuit; EGFET electrochemical sensing; IO pad design; Silterra technology; current source; integrated constant voltage constant current readout interfacing circuit; ion sensing membrane; ionic activities solution; operational amplifier; single chip smart sensor system; size 0.13 mum; voltage reference circuit; Electric potential; Integrated circuit modeling; Layout; Logic gates; MOSFET; Sensors; CVCC Readout circuit; EGFET; three stage operational amplifier;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Electronics (ICSE), 2014 IEEE International Conference on
  • Conference_Location
    Kuala Lumpur
  • Type

    conf

  • DOI
    10.1109/SMELEC.2014.6920892
  • Filename
    6920892