• DocumentCode
    1149205
  • Title

    An architectural approach for increasing clock frequency and communication speed in monolithic WSI systems

  • Author

    Audet, D. ; Savaria, Y.

  • Author_Institution
    Dept. of Applied Sci., Univ. du Quebec, Chicoutimi, Que., Canada
  • Volume
    17
  • Issue
    3
  • fYear
    1994
  • fDate
    8/1/1994 12:00:00 AM
  • Firstpage
    362
  • Lastpage
    368
  • Abstract
    Based on a special pipelining technique, a new methodology for increasing the clock frequency and communication speed in monolithic WSI systems is proposed. SPICE simulations show that the clock frequency on a synchronous wafer-scale system, implemented using a 1.2 μm CMOS technology, can be operated well above 140 MHz, which is approximately five times the maximum frequency of current systems. It is also shown that frequencies higher than 1 GHz can be achieved if the technique is pushed to its limits. The methodology can be applied to interconnection networks as well, thereby improving their speed by approximately the same factor. In order to assess the various design tradeoffs imposed by the technique, a prototype communication interface has been designed using 1.2 μm CMOS standard cells. This interface is intended to be used in a special distributed-queue, dual-bus (DQDB) communication network
  • Keywords
    CMOS integrated circuits; SPICE; VLSI; circuit analysis computing; clocks; digital integrated circuits; network interfaces; pipeline processing; synchronisation; 1 GHz; 1.2 micron; 140 MHz; CMOS technology; DQDB network; SPICE simulations; architecture; clock frequency; communication interface; communication speed; design; distributed-queue dual-bus communication network; interconnection networks; monolithic WSI systems; pipelining technique; synchronous wafer-scale system; CMOS technology; Clocks; Frequency; Inverters; Pipeline processing; Propagation delay; Prototypes; SPICE; Very large scale integration; Wires;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9894
  • Type

    jour

  • DOI
    10.1109/96.311785
  • Filename
    311785