Title :
SOI design for competitive CMOS VLSI
Author :
Fossum, Jerry G. ; Choi, Jin-young ; Sundaresan, Ravishankar
Author_Institution :
Dept. of Electr. Eng., Florida Univ., Gainesville, FL, USA
fDate :
3/1/1990 12:00:00 AM
Abstract :
Device simulations using a physical SOI MOSFET model implemented in SPICE2 predict that properly designed silicon-on-insulator (SOI) has a substantial advantage over bulk CMOS VLSI with regard to hot-carrier-induced degradation. The simulations show that the (short-) n-channel SOI MOSFET, designed with moderately thin (not ultrathin) film having complete depletion in the film and at the back surface, and without an LDD region, will degrade much more slowly than a contemporary bulk MOSFET with an LDD. This suggests that the 5-V source can be retained for submicrometer SOI CMOS, whereas it must be lowered for bulk CMOS. The simulations and the optimal SOI designs they suggest are supported by measurements of thin-film and bulklike MOSFETs fabricated in SIMOX SOI
Keywords :
CMOS integrated circuits; VLSI; electronic engineering computing; hot carriers; insulated gate field effect transistors; semiconductor device models; semiconductor-insulator boundaries; SIMOX SOI; SPICE2; Si on insulator; device simulation; hot-carrier-induced degradation; optimal SOI designs; physical SOI MOSFET model; CMOS technology; Degradation; Hot carriers; Isolation technology; MOSFET circuits; Predictive models; Semiconductor device modeling; Silicon on insulator technology; Transistors; Very large scale integration;
Journal_Title :
Electron Devices, IEEE Transactions on