DocumentCode
1151760
Title
SOI design for competitive CMOS VLSI
Author
Fossum, Jerry G. ; Choi, Jin-young ; Sundaresan, Ravishankar
Author_Institution
Dept. of Electr. Eng., Florida Univ., Gainesville, FL, USA
Volume
37
Issue
3
fYear
1990
fDate
3/1/1990 12:00:00 AM
Firstpage
724
Lastpage
729
Abstract
Device simulations using a physical SOI MOSFET model implemented in SPICE2 predict that properly designed silicon-on-insulator (SOI) has a substantial advantage over bulk CMOS VLSI with regard to hot-carrier-induced degradation. The simulations show that the (short-) n-channel SOI MOSFET, designed with moderately thin (not ultrathin) film having complete depletion in the film and at the back surface, and without an LDD region, will degrade much more slowly than a contemporary bulk MOSFET with an LDD. This suggests that the 5-V source can be retained for submicrometer SOI CMOS, whereas it must be lowered for bulk CMOS. The simulations and the optimal SOI designs they suggest are supported by measurements of thin-film and bulklike MOSFETs fabricated in SIMOX SOI
Keywords
CMOS integrated circuits; VLSI; electronic engineering computing; hot carriers; insulated gate field effect transistors; semiconductor device models; semiconductor-insulator boundaries; SIMOX SOI; SPICE2; Si on insulator; device simulation; hot-carrier-induced degradation; optimal SOI designs; physical SOI MOSFET model; CMOS technology; Degradation; Hot carriers; Isolation technology; MOSFET circuits; Predictive models; Semiconductor device modeling; Silicon on insulator technology; Transistors; Very large scale integration;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.47778
Filename
47778
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