DocumentCode :
1153208
Title :
Dual-Material-Gate Technique for Enhanced Transconductance and Breakdown Voltage of Trench Power MOSFETs
Author :
Saxena, Raghvendra S. ; Kumar, M. Jagadesh
Author_Institution :
Dept. of Electr. Eng., Indian Inst. of Technol., New Delhi
Volume :
56
Issue :
3
fYear :
2009
fDate :
3/1/2009 12:00:00 AM
Firstpage :
517
Lastpage :
522
Abstract :
In this brief, we propose a new dual-material-gate-trench power MOSFET that exhibits a significant improvement in its transconductance and breakdown voltage without any degradation in on-resistance. In the proposed structure, we have split the gate of a conventional trench MOSFET structure into two parts for work-function engineering. The two gates share the control of the inversion charge in the channel. By using 2-D numerical simulation, we have shown that by adjusting the lengths of the two gates to allow equal share of the inversion charge by them, we get the optimum device performance. By using N+ poly-Si as a lower gate material and P+ poly-Si as an upper gate material, approximately 44% improvement in peak transconductance and 20% improvement in breakdown voltage may be achieved in the new device compared to the conventional trench MOSFET.
Keywords :
elemental semiconductors; power MOSFET; semiconductor device breakdown; semiconductor device models; silicon; work function; 2D numerical simulation; N+ poly-Si lower gate material; P+ poly-Si upper gate material; Si; breakdown voltage; dual-material-gate technique; inversion charge; on-resistance; transconductance; trench power MOSFET; work-function engineering; Automotive electronics; Conducting materials; Degradation; MOSFETs; Microprocessors; Numerical simulation; Power engineering and energy; Switching converters; Transconductance; Voltage; Breakdown voltage; dual material gate; on-resistance; power MOSFET; trench gate;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2008.2011723
Filename :
4781546
Link To Document :
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