A 3-D Low Jitter and Skew Clock Distribution Network Scheme Using LTCC Package Level Interposer With a Planar Cavity Resonator

Author

Lee, Woojin ; Kim, Jaemin ; Ryu, Chunghyun ; Park, Jongbae ; Kim, Jun Chul ; Kim, Joungho

Author_Institution

Dept. of Electr. Eng. & Comput. Sci. (EECS), Korea Adv. Inst. of Sci. & Technol. (KAIST), Daejeon, South Korea

Volume

19

Issue

8

fYear

2009

Firstpage

512

Lastpage

514

Abstract

In this paper, we propose a new three-dimensional (3-D) clock distribution network (CDN) scheme using a low temperature co-fired ceramic (LTCC) package level interposer with a planar cavity resonator to achieve extremely low jitter and skew clock delivery even in severe power supply noise environments, especially for digital chips in 3-D stacked chip packages. It is based on a uniform-phase of the standing wave at the quarter-wavelength planar cavity resonator embedded inside the LTCC interposer. Substantial suppression of the timing jitter and skew was successfully demonstrated through a series of design, fabrication, and measurement processes of test devices and packages.

Keywords

cavity resonators; ceramic packaging; clocks; distribution networks; integrated circuit packaging; jitter; microwave integrated circuits; timing jitter; LTCC interposer; digital chips; low temperature co-fired ceramic package interposer; power supply noise environments; quarter-wavelength planar cavity resonator; skew clock delivery; standing wave uniform phase; three-dimensional clock distribution network; timing jitter suppression; 3-D stacked chip package; Clock distribution; interposer; jitter; quarter-wavelength resonance; skew;

fLanguage

English

Journal_Title

Microwave and Wireless Components Letters, IEEE

Publisher

ieee

ISSN

1531-1309

Type

jour

DOI

10.1109/LMWC.2009.2024841

Filename

5175487