• DocumentCode
    1153808
  • Title

    Unified Logical Effort—A Method for Delay Evaluation and Minimization in Logic Paths With RC Interconnect

  • Author

    Morgenshtein, Arkadiy ; Friedman, Eby G. ; Ginosar, Ran ; Kolodny, Avinoam

  • Author_Institution
    Dept. of Electr. Eng., Technion - Israel Inst. of Technol., Haifa, Israel
  • Volume
    18
  • Issue
    5
  • fYear
    2010
  • fDate
    5/1/2010 12:00:00 AM
  • Firstpage
    689
  • Lastpage
    696
  • Abstract
    The unified logical effort (ULE) model for delay evaluation and minimization in paths composed of CMOS logic gates and resistive wires is presented. The method provides conditions for timing optimization while overcoming the limitations of standard logical effort (LE) in the presence of interconnects. The condition for optimal gate sizing in a logic path with long wires is also presented. This condition is achieved when the delay component due to the gate input capacitance is equal to the delay component due to the effective output resistance of the gate. The ULE delay model unifies the problems of gate sizing and repeater insertion: In the case of negligible interconnect, the ULE method converges to standard LE optimization, yielding tapered gate sizes. In the case of long wires, the solution converges toward uniform sizing of gates and repeaters. The technique is applied to various types of logic paths to demonstrate the influence of wire length, gate type, and technology.
  • Keywords
    CMOS logic circuits; RC circuits; electric resistance; integrated circuit interconnections; logic gates; repeaters; wires (electric); CMOS logic gate; LE optimization; RC interconnect; ULE delay model; delay evaluation; delay minimization; gate input capacitance; gate type; logic path; long wire; optimal gate sizing; output resistance; repeater insertion; resistive wire; timing optimization; unified logical effort; wire length; Delay minimization; interconnect; logical effort (LE); power;
  • fLanguage
    English
  • Journal_Title
    Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1063-8210
  • Type

    jour

  • DOI
    10.1109/TVLSI.2009.2014239
  • Filename
    5175549