DocumentCode :
1153953
Title :
Reduction of PFC emissions to the environment through advances in CVD and etch processes
Author :
Johnson, Andrew D. ; Ridgeway, Robert G. ; Maroulis, Peter J.
Author_Institution :
Air Products & Chem.s Inc., Allentown, PA, USA
Volume :
17
Issue :
4
fYear :
2004
Firstpage :
491
Lastpage :
496
Abstract :
One the most focused environmental health and safety (EHS) goals for the semiconductor industry has been to reduce perfluorocompound (PFC) emissions because of their high global warming potentials and long residence times in the atmosphere. During the last decade, significant achievements have been reached in attaining this goal. Chemical vapor deposition (CVD) chamber cleaning and plasma etch are two processes that use PFCs in which studies have been conducted to reduce emissions. Two successful strategies for reducing PFC emissions and enhancing process performance are described.
Keywords :
air pollution control; clean rooms; elemental semiconductors; integrated circuit manufacture; plasma CVD; semiconductor thin films; silicon; sputter etching; surface cleaning; CVD; Si; chemical vapor deposition chamber cleaning; environmental health; environmental safety; global warming; perfluorocompound emissions; plasma emissions; plasma etching; semiconductor industry; Chemical vapor deposition; Etching; Gases; Noise measurement; Plasma applications; Plasma chemistry; Plasma devices; Response surface methodology; Surface cleaning; Throughput; 65; CVD; Chamber clean; PFC; chemical vapor deposition; emissions; perfluorocompound; plasma etch;
fLanguage :
English
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
0894-6507
Type :
jour
DOI :
10.1109/TSM.2004.835700
Filename :
1353301
Link To Document :
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