Title :
"Dry" lithography using liquid and supercritical carbon dioxide based chemistries and processes
Author :
Hoggan, Erik N. ; Wang, Ke ; Flowers, Devin ; DeSimone, Joseph M. ; Carbonell, Ruben G.
Author_Institution :
Dept. of Chem. Eng., North Carolina State Univ., Raleigh, NC, USA
Abstract :
Novel carbon dioxide (CO2) soluble photoresists were synthesized based on random copolymers of 1,1-dihydroperfluorooctylmethacrylate and 2-tetrahyrdopyranyl methacrylate. These resins, along with specially designed CO2-soluble photoacid generators, were utilized to demonstrate the potential for a new "dry" lithographic process. Photoresist spin casting, development, and stripping were all carried out using only liquid and supercritical CO2 as the processing medium. A novel high-pressure spin coating process was used to deposit the photoresist films. Parameters such as resist sensitivity, contrast, and resolution were investigated. Wafers were imaged using both 248and 193-nm radiation, demonstrating the potential of this new photoresist platform for use as a sustainable technology for the microelectronics industry.
Keywords :
carbon compounds; lithography; photochemistry; photoresists; polymer blends; polymer films; spin coating; 1,1-dihydroperfluorooctylmethacrylate; 193 nm; 2-tetrahyrdopyranyl methacrylate; 248 nm; CO2; CO2-soluble photoacid generators; carbon dioxide soluble photoresists; dry lithography; high pressure spin coating; liquid carbon dioxide; microelectronics industry; photoresist films; photoresist spin casting; random copolymers; supercritical carbon dioxide; wafers; Carbon dioxide; Chemical engineering; Chemistry; Coatings; Lithography; Manufacturing industries; Microelectronics; Resists; Semiconductor films; Solvents; 65; Liquid and supercritical carbon dioxide; lithography; photoacid generator; photoresist; resist contrast; resist sensitivity;
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
DOI :
10.1109/TSM.2004.837002
