• DocumentCode
    1153991
  • Title

    Acoustically actuated flextensional SixNy and single-crystal silicon 2-D micromachined ejector arrays

  • Author

    Demirci, Utkan ; Yaralioglu, Goksen G. ; Haeggström, Edward ; Perçin, Gökhan ; Ergun, Sanli ; Khuri-Yakub, B.T.

  • Author_Institution
    Dept. of Electr. Eng., Stanford Univ., CA, USA
  • Volume
    17
  • Issue
    4
  • fYear
    2004
  • Firstpage
    517
  • Lastpage
    524
  • Abstract
    We propose using two-dimensional (2-D) micromachined droplet ejector arrays for environmentally benign deposition of photoresist and other spin-on materials, such as low-k and high-k dielectrics used in IC manufacturing. Direct deposition of these chemicals will reduce waste as well as production cost. The proposed device does not harm heat or pressure sensitive fluids and they are chemically compatible with the materials used in IC manufacturing. Each element of the 2-D ejector array consists of a flexurally vibrating circular membrane on one face of a cylindrical fluid reservoir. The membrane has an orifice at the center. A piezoelectric transducer generating ultrasonic waves, located at the open face of the reservoir, actuates the membranes. As a result of this actuation, droplets are fired through the membrane orifice. Ejector arrays were built with either SixNy or single-crystal silicon membranes using two different fabrication processes. We show that single-crystal silicon membranes are more uniform in their thickness and material quality than those of SixNy membranes. The single-crystal silicon membrane-based devices showed thickness and material uniformity across all the membranes of an array. This improvement eliminated nonuniform membrane resonance frequencies across an array as observed with SixNy membrane-based devices. Therefore, it should be possible to repeatably build devices and to predict their dynamic characteristics. Using the fabricated devices, we demonstrated water ejection at 470 kHz, 1.24 MHz, and 2.26 MHz. The corresponding droplet diameters were 6.5, 5, and 3.5 μm, respectively.
  • Keywords
    integrated circuit manufacture; micromachining; photoresists; piezoelectric transducers; semiconductor thin films; silicon; ultrasonic transducer arrays; 1.24 MHz; 2.26 MHz; 3.5 micron; 470 kHz; 5 micron; 6.5 micron; IC manufacturing; Si; dielectrics; flexurally vibrating circular membrane; photoresist; piezoelectric transducer; silicon membranes; single-crystal silicon 2D micromachined ejector arrays; ultrasonic wave generation; water ejection; Biomembranes; Chemical products; High K dielectric materials; High-K gate dielectrics; Manufacturing; Orifices; Reservoirs; Resists; Silicon; Two dimensional displays; 65; Deposition; MEMS; droplet ejection; inkjet; microelectromechanical systems; transducer; ultrasound; wafer coating;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/TSM.2004.835714
  • Filename
    1353305