Title :
Characterization of copper voids in damascene processes
Author :
Guldi, Richard L. ; Shaw, Judy B. ; Ritchison, Jeffrey ; Corum, Daniel L. ; Oestreich, Steven ; Sherman, Kara ; Lin, Jason H. ; Fiordalice, Robert
Author_Institution :
Texas Instrum. Inc., Dallas, TX, USA
Abstract :
The introduction of copper Damascene processing into integrated circuits has brought about a host of new defectivity issues, especially those related to pitting and voiding. These defects must be understood and eliminated to achieve competitive manufacturing yields and assure device reliability. This paper reviews various defect inspection methodologies that are useful for characterizing copper voids and their electrical effects.
Keywords :
copper; inspection; integrated circuit measurement; integrated circuit metallisation; integrated circuit reliability; integrated circuit yield; voids (solid); Cu; copper voids; damascene processes; defect inspection; device reliability; electrical effects; integrated circuits; manufacturing yields; pitting; Annealing; Character generation; Copper; Helium; Inspection; Integrated circuit reliability; Integrated circuit yield; Manufacturing; Virtual colonoscopy; Voltage; 65; Copper defectivity; Damascene; copper inspection; defect source partitioning; e-beam inspection;
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
DOI :
10.1109/TSM.2004.835721
