Characterization of copper voids in damascene processes

Author

Guldi, Richard L. ; Shaw, Judy B. ; Ritchison, Jeffrey ; Corum, Daniel L. ; Oestreich, Steven ; Sherman, Kara ; Lin, Jason H. ; Fiordalice, Robert

Author_Institution

Texas Instrum. Inc., Dallas, TX, USA

Volume

17

Issue

4

fYear

2004

Firstpage

597

Lastpage

602

Abstract

The introduction of copper Damascene processing into integrated circuits has brought about a host of new defectivity issues, especially those related to pitting and voiding. These defects must be understood and eliminated to achieve competitive manufacturing yields and assure device reliability. This paper reviews various defect inspection methodologies that are useful for characterizing copper voids and their electrical effects.

Keywords

copper; inspection; integrated circuit measurement; integrated circuit metallisation; integrated circuit reliability; integrated circuit yield; voids (solid); Cu; copper voids; damascene processes; defect inspection; device reliability; electrical effects; integrated circuits; manufacturing yields; pitting; Annealing; Character generation; Copper; Helium; Inspection; Integrated circuit reliability; Integrated circuit yield; Manufacturing; Virtual colonoscopy; Voltage; 65; Copper defectivity; Damascene; copper inspection; defect source partitioning; e-beam inspection;

fLanguage

English

Journal_Title

Semiconductor Manufacturing, IEEE Transactions on

Publisher

ieee

ISSN

0894-6507

Type

jour

DOI

10.1109/TSM.2004.835721

Filename

1353316