DocumentCode
1154144
Title
Automated analysis structures for BiCMOS process simulation, development, and verification
Author
Leibiger, Steven ; Huber, Jeff ; Qazi, Shafaat ; Frankwicz, Peter ; Goepfert, Ian D.
Author_Institution
Fairchild Semicond. Corp., South Portland, ME, USA
Volume
17
Issue
4
fYear
2004
Firstpage
612
Lastpage
618
Abstract
This paper presents a system of BiCMOS process step simulation, development, and verification using automatically generated physical test structures. During process development, detailed unit process step deliverables are compiled in a document called the process technology table (PTT). These targets are initially set by equipment capabilities, product needs, and process simulations, but every PTT entry must be ultimately verified on silicon. Therefore, the process development engineers require a method of specifying, simulating, and analyzing a large variety of process test structures. A computer-aided design system to do this has been developed. The particulars of its use during the integration of a 0.35-μm BiCMOS process flow are presented. Details about a novel cross-sectional structure labeling and identification scheme are also presented.
Keywords
BiCMOS integrated circuits; electronic engineering computing; integrated circuit modelling; semiconductor process modelling; technology CAD (electronics); 0.35 micron; BiCMOS process development; BiCMOS process flow; BiCMOS process simulation; BiCMOS process verification; automated analysis structure; computer-aided design system; equipment capabilities; process development engineers; process technology table; silicon; Analytical models; Automatic testing; BiCMOS integrated circuits; Computational modeling; Design automation; Pattern analysis; Production; Scanning electron microscopy; System testing; Thickness measurement; 65; Physical analysis; SEM; analysis; scanning electron microscope; test pattern design; unit process development;
fLanguage
English
Journal_Title
Semiconductor Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
0894-6507
Type
jour
DOI
10.1109/TSM.2004.835698
Filename
1353318
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