DocumentCode :
1154144
Title :
Automated analysis structures for BiCMOS process simulation, development, and verification
Author :
Leibiger, Steven ; Huber, Jeff ; Qazi, Shafaat ; Frankwicz, Peter ; Goepfert, Ian D.
Author_Institution :
Fairchild Semicond. Corp., South Portland, ME, USA
Volume :
17
Issue :
4
fYear :
2004
Firstpage :
612
Lastpage :
618
Abstract :
This paper presents a system of BiCMOS process step simulation, development, and verification using automatically generated physical test structures. During process development, detailed unit process step deliverables are compiled in a document called the process technology table (PTT). These targets are initially set by equipment capabilities, product needs, and process simulations, but every PTT entry must be ultimately verified on silicon. Therefore, the process development engineers require a method of specifying, simulating, and analyzing a large variety of process test structures. A computer-aided design system to do this has been developed. The particulars of its use during the integration of a 0.35-μm BiCMOS process flow are presented. Details about a novel cross-sectional structure labeling and identification scheme are also presented.
Keywords :
BiCMOS integrated circuits; electronic engineering computing; integrated circuit modelling; semiconductor process modelling; technology CAD (electronics); 0.35 micron; BiCMOS process development; BiCMOS process flow; BiCMOS process simulation; BiCMOS process verification; automated analysis structure; computer-aided design system; equipment capabilities; process development engineers; process technology table; silicon; Analytical models; Automatic testing; BiCMOS integrated circuits; Computational modeling; Design automation; Pattern analysis; Production; Scanning electron microscopy; System testing; Thickness measurement; 65; Physical analysis; SEM; analysis; scanning electron microscope; test pattern design; unit process development;
fLanguage :
English
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
0894-6507
Type :
jour
DOI :
10.1109/TSM.2004.835698
Filename :
1353318
Link To Document :
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