• DocumentCode
    1154144
  • Title

    Automated analysis structures for BiCMOS process simulation, development, and verification

  • Author

    Leibiger, Steven ; Huber, Jeff ; Qazi, Shafaat ; Frankwicz, Peter ; Goepfert, Ian D.

  • Author_Institution
    Fairchild Semicond. Corp., South Portland, ME, USA
  • Volume
    17
  • Issue
    4
  • fYear
    2004
  • Firstpage
    612
  • Lastpage
    618
  • Abstract
    This paper presents a system of BiCMOS process step simulation, development, and verification using automatically generated physical test structures. During process development, detailed unit process step deliverables are compiled in a document called the process technology table (PTT). These targets are initially set by equipment capabilities, product needs, and process simulations, but every PTT entry must be ultimately verified on silicon. Therefore, the process development engineers require a method of specifying, simulating, and analyzing a large variety of process test structures. A computer-aided design system to do this has been developed. The particulars of its use during the integration of a 0.35-μm BiCMOS process flow are presented. Details about a novel cross-sectional structure labeling and identification scheme are also presented.
  • Keywords
    BiCMOS integrated circuits; electronic engineering computing; integrated circuit modelling; semiconductor process modelling; technology CAD (electronics); 0.35 micron; BiCMOS process development; BiCMOS process flow; BiCMOS process simulation; BiCMOS process verification; automated analysis structure; computer-aided design system; equipment capabilities; process development engineers; process technology table; silicon; Analytical models; Automatic testing; BiCMOS integrated circuits; Computational modeling; Design automation; Pattern analysis; Production; Scanning electron microscopy; System testing; Thickness measurement; 65; Physical analysis; SEM; analysis; scanning electron microscope; test pattern design; unit process development;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/TSM.2004.835698
  • Filename
    1353318