A cost-effective solution for packaging the arrayed waveguide grating (AWG) photonic components

Author

Zhang, Zhiyi ; Xiao, Gao Zhi ; Liu, Jiaren ; Grover, Chander P. ; Nikumb, Suwas ; Reshef, Hugo W.

Author_Institution

Inst. for Nat. Meas. Stand., Nat. Res. Council Canada, Ottawa, Ont., Canada

Volume

28

Issue

3

fYear

2005

Firstpage

564

Lastpage

570

Abstract

Precision laser machining technology was used to cut arrayed waveguide grating (AWG) devices from 6-in wafers by following their complex profiles in a fully automatic way. A substantial cost saving in components manufacturing was achieved by an obtained device-cutting yield of 100%. The profile-cut AWG devices have smooth cutting edges and their optical performances were found unaffected by the cutting. These devices were processed in the subsequent packaging process easily without adding cost. They were proven mechanically stable in their packaging in meeting the telecommunication standards even though they have irregular geometry.

Keywords

arrayed waveguide gratings; electronics packaging; laser beam cutting; laser beam machining; arrayed waveguide grating devices; arrayed waveguide grating packaging; components manufacturing; cutting edges; device-cutting yield; irregular geometry; laser cutting; packaging process; photonic components; precision laser machining technology; telecommunication standards; Arrayed waveguide gratings; Components, packaging, and manufacturing technology; Costs; Laser beam cutting; Machining; Optical arrays; Optical waveguides; Packaging machines; Waveguide components; Waveguide lasers; Arrayed waveguide grating (AWG); laser cutting; packaging; photonic components;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/TCAPT.2005.848582

Filename

1501960