DocumentCode :
1155036
Title :
Degrading effect of high-altitude corona on electronic circuit boards
Author :
Karady, George G. ; Sirkis, Murray D. ; Oliva, Jose R.
Author_Institution :
Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
Volume :
26
Issue :
6
fYear :
1991
fDate :
12/1/1991 12:00:00 AM
Firstpage :
1216
Lastpage :
1219
Abstract :
A printed circuit board with attached components has been subjected to corona discharges for 200 h at a pressure of 8.66 Pa. The preliminary investigations indicate that: (1) High altitude corona discharges produce visible surface degradation on electronic circuit boards and mounted components. (2) The deterioration is most pronounced in the regions where the electric field is greatest. (3) The solder coating has been removed in localized areas of the interconnecting paths and the underlying copper is now exposed. (4) The circuit board becomes covered with a white dust, the composition of which is still unknown. (5) The deterioration increases with increased exposure up to 200 h, the maximum exposure time considered here
Keywords :
corona; life testing; printed circuit testing; 200 h; 8.66 Pa; corona discharges; deterioration; electric field; electronic circuit boards; exposure time; high-altitude corona; solder coating; surface degradation; Circuit testing; Conducting materials; Corona; Degradation; Dielectric materials; Dielectrics and electrical insulation; Electronic circuits; Integrated circuit interconnections; Plastics; Printed circuits;
fLanguage :
English
Journal_Title :
Electrical Insulation, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9367
Type :
jour
DOI :
10.1109/14.108161
Filename :
108161
Link To Document :
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