Thermal strain analysis in optical planar waveguides

Author

Zhao, Xiuli ; Xu, Y.Z. ; Li, Chunfei

Author_Institution

Dept. of Phys., Harbin Inst. of Technol., China

Volume

15

Issue

3

fYear

2003

fDate

3/1/2003 12:00:00 AM

Firstpage

398

Lastpage

400

Abstract

For the first time, we derive an analytical form of the thermal-induced strain equation for the waveguide core layer in an optical planar waveguide, which is based on elastic interaction theory in multilayered isotropic structures off the edges by thin-film approximation. This derived equation addresses how material and structural characteristics affect the magnitude and the distribution of the strain. By this equation, the strain-induced birefringence can be reduced or eliminated by proper waveguide design.

Keywords

mechanical birefringence; optical planar waveguides; optical waveguide theory; thermal expansion; thermo-optical effects; analytical form; elastic interaction theory; material characteristics; multilayered isotropic structures; optical planar waveguide; strain-induced birefringence; structural characteristics; thermal strain analysis; thermal-induced strain equation; thin-film approximation; waveguide core layer; waveguide design; Birefringence; Capacitive sensors; Optical films; Optical planar waveguides; Optical waveguide theory; Optical waveguides; Planar waveguides; Substrates; Thermal expansion; Thermal stresses;

fLanguage

English

Journal_Title

Photonics Technology Letters, IEEE

Publisher

ieee

ISSN

1041-1135

Type

jour

DOI

10.1109/LPT.2002.807924

Filename

1182770