Title :
Applications of layer-by-layer polymer stereolithography for three-dimensional high-frequency components
Author :
Liu, Bosui ; Gong, Xun ; Chappell, William J.
Author_Institution :
Electr. & Comput. Eng. Dept., Purdue Univ., West Lafayette, IN, USA
Abstract :
A laser-based layer-by-layer additive process, stereolithography, is used to create truly three-dimensional (3-D) structures for high-frequency applications. High aspect-ratio complicated 3-D structures embedded inside of a layer-by-layer package are created by this process. Previously, Q´s greater than 3000 and tolerances of ∼0.19% have been achieved for embedded resonators. In this paper, more applications are demonstrated. Particular examples include the integration of a nonplanar monopole antenna coupled to a high-Q embedded cavity with only 0.26% shift in resonant frequency (19.37 GHz) and a slight 0.06% reduction in bandwidth compared to simulation. Stacked cavities and coupling sections within a substrate are also demonstrated to create vertically integrated filters. For 2% bandwidth two-pole filters, insertion losses as small as 0.27 dB are measured. Furthermore, a vertically integrated 1.2% four-pole filter is demonstrated with acceptable performance without tuning after fabrication. These applications illustrate that the laser-based stereolithography process is suitable for the integration of high-frequency and high-Q 3-D structures within a package.
Keywords :
band-pass filters; cavity resonators; electronics packaging; laser beam applications; micromachining; microwave antennas; microwave filters; monopole antennas; stereolithography; embedded resonators; high-Q embedded cavity; laser based layer-by-layer additive process; laser based stereolithography process; layer-by-layer package; layer-by-layer polymer stereolithography; nonplanar monopole antenna; three dimensional high-frequency components; three dimensional structures; two pole filters; vertically integrated filters; Bandwidth; Filters; Insertion loss; Laser tuning; Loss measurement; Optical device fabrication; Packaging; Polymers; Resonant frequency; Stereolithography; -D; 65; Cavity resonators; embedded packaging; fabrication; fabrication tolerance; layer-by-layer three-dimensional; metal loss; narrow bandpass filter; stereolithography;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
DOI :
10.1109/TMTT.2004.837165