Title :
Materials selection in micromechanical design: an application of the Ashby approach
Author :
Srikar, V.T. ; Spearing, S. Mark
Author_Institution :
Dept. of Aeronaut. & Astronaut., MIT, Cambridge, MA, USA
fDate :
2/1/2003 12:00:00 AM
Abstract :
The set of materials available to microsystems designers is rapidly expanding. Techniques now exist to introduce and integrate a large number of metals, alloys, ceramics, glasses, polymers, and elastomers into microsystems, motivating the need for a rational approach for materials selection in microsystems design. As a step toward such an approach, we focus on the initial stages of materials selection for micromechanical structures with minimum feature sizes greater than 1 μm. The variation of mechanical properties with length scale and processing parameters is discussed. Bounds for initial design values of several properties are suggested and the necessity for the measurement of other properties (especially residual stresses and intrinsic loss coefficients) is discussed. Adapting the methods pioneered by Ashby et al., materials indices are formulated for a number of properties and materials selection charts are presented. These concepts are applied to illustrate initial materials selection for shock-resistant microbeams, force sensors, micromechanical filters, and micromachined flexures. Issues associated with the integration of materials into microsystems are briefly discussed.
Keywords :
internal stresses; micromachining; micromechanical devices; microsensors; passive filters; Ashby approach; feature sizes; force sensors; initial design values; intrinsic loss coefficients; materials indices; materials selection; micromachined flexures; micromechanical design; micromechanical filters; micromechanical structures; microsystems design; processing parameters; residual stresses; shock-resistant microbeams; Ceramics; Force sensors; Glass; Inorganic materials; Loss measurement; Mechanical factors; Micromechanical devices; Polymers; Residual stresses; Stress measurement;
Journal_Title :
Microelectromechanical Systems, Journal of
DOI :
10.1109/JMEMS.2002.807466