• DocumentCode
    1156585
  • Title

    Creating, transporting, cutting, and merging liquid droplets by electrowetting-based actuation for digital microfluidic circuits

  • Author

    Cho, Sung Kwon ; Moon, Hyejin ; Kim, Chang-Jin

  • Author_Institution
    Mech. & Aerosp. Eng. Dept., Univ. of California, Los Angeles, CA, USA
  • Volume
    12
  • Issue
    1
  • fYear
    2003
  • fDate
    2/1/2003 12:00:00 AM
  • Firstpage
    70
  • Lastpage
    80
  • Abstract
    Reports the completion of four fundamental fluidic operations considered essential to build digital microfluidic circuits, which can be used for lab-on-a-chip or micro total analysis system (μTAS): 1) creating, 2) transporting, 3) cutting, and 4) merging liquid droplets, all by electrowetting, i.e., controlling the wetting property of the surface through electric potential. The surface used in this report is, more specifically, an electrode covered with dielectrics, hence, called electrowetting-on-dielectric (EWOD). All the fluidic movement is confined between two plates, which we call parallel-plate channel, rather than through closed channels or on open surfaces. While transporting and merging droplets are easily verified, we discover that there exists a design criterion for a given set of materials beyond which the droplet simply cannot be cut by EWOD mechanism. The condition for successful cutting is theoretically analyzed by examining the channel gap, the droplet size and the degree of contact angle change by electrowetting on dielectric (EWOD). A series of experiments is run and verifies the criterion.
  • Keywords
    digital circuits; drops; electrochemical analysis; microactuators; microfluidics; wetting; EWOD; channel gap; contact angle change; digital microfluidic circuits; droplet size; electrowetting-based actuation; electrowetting-on-dielectric; lab-on-a-chip; liquid droplets; micro total analysis system; parallel-plate channel; Circuits; Dielectric liquids; Electric potential; Electrodes; Lab-on-a-chip; Merging; Microfluidics; Micromechanical devices; Moon; Surface tension;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2002.807467
  • Filename
    1183744