Simple and improved dielectric parameter extraction of thin organic packaging materials using open-ended coaxial line technique

A low cost model utilising foam as an optimum sample backing has been used to measure the complex permittivity of thin packaging substrates over a broadband frequency of 0.1-20 GHz. Based on the open-ended coaxial line technique, the model validity has been verified both theoretically and experimentally, and a good accuracy is achieved. In addition, the model provides convenient probe calibration, thus enabling a fast extraction of the dielectric parameters utilising one port measurements. In particular, good agreement between the measured results and the manufacturer´s data has been obtained, along with stable values of the material dielectric parameters over wide band frequencies. A good correlation has also been obtained between the measurement and simulation results over broadband.