DocumentCode
1158020
Title
A Comparative Study of Electrical Characteristic on Sub-10-nm Double-Gate MOSFETs
Author
Li, Yiming ; Chou, Hong-Mu
Volume
4
Issue
5
fYear
2005
Firstpage
645
Lastpage
647
Abstract
We explore the structure effect on electrical characteristics of sub-10-nm double-gate metal–oxide–semiconductor field-effect transistors (DG MOSFETs). To quantitatively assess the nanoscale DG MOSFETs\´ characteristics, the on/off current ratio, subthreshold swing, threshold voltage
, and drain-induced barrier-height lowering are numerically calculated for the device with different channel length (
) and the thickness of silicon film
. Based on our two-dimensional density gradient simulation, it is found that, to maintain optimal device characteristics and suppress short channel effects (SCEs) for nanoscale DG MOSFETs,
should be simultaneously scaled down with respect to
. From a practical fabrication point-of-view, a DG MOSFET with ultrathin
will suppress the SCE, but suffers the fabrication process and on-state current issues. Simulation results suggest that
may provide a good alternative in eliminating SCEs of double-gate-based nanodevices.
, and drain-induced barrier-height lowering are numerically calculated for the device with different channel length (
) and the thickness of silicon film
. Based on our two-dimensional density gradient simulation, it is found that, to maintain optimal device characteristics and suppress short channel effects (SCEs) for nanoscale DG MOSFETs,
should be simultaneously scaled down with respect to
. From a practical fabrication point-of-view, a DG MOSFET with ultrathin
will suppress the SCE, but suffers the fabrication process and on-state current issues. Simulation results suggest that
may provide a good alternative in eliminating SCEs of double-gate-based nanodevices.Keywords
Adaptive computation; channel length; density gradient drift-diffusion model; double-gate MOSFET; drain-induced barrier height lowering; numerical simulation; on/off current ratio; quantum correction transport model; sub 10 nm; subthreshold swing; system-on-a-chip (SOC); thickness of silicon film; threshold voltage; very large scale integration (VLSI); Circuits; Computational modeling; Electric variables; Fabrication; MOSFETs; Nanoscale devices; Quantum computing; Semiconductor films; Silicon; Threshold voltage; Adaptive computation; channel length; density gradient drift-diffusion model; double-gate MOSFET; drain-induced barrier height lowering; numerical simulation; on/off current ratio; quantum correction transport model; sub 10 nm; subthreshold swing; system-on-a-chip (SOC); thickness of silicon film; threshold voltage; very large scale integration (VLSI);
fLanguage
English
Journal_Title
Nanotechnology, IEEE Transactions on
Publisher
ieee
ISSN
1536-125X
Type
jour
DOI
10.1109/TNANO.2005.851440
Filename
1504726
Link To Document