DocumentCode :
1158020
Title :
A Comparative Study of Electrical Characteristic on Sub-10-nm Double-Gate MOSFETs
Author :
Li, Yiming ; Chou, Hong-Mu
Volume :
4
Issue :
5
fYear :
2005
Firstpage :
645
Lastpage :
647
Abstract :
We explore the structure effect on electrical characteristics of sub-10-nm double-gate metal–oxide–semiconductor field-effect transistors (DG MOSFETs). To quantitatively assess the nanoscale DG MOSFETs\´ characteristics, the on/off current ratio, subthreshold swing, threshold voltage ( V_ th) , and drain-induced barrier-height lowering are numerically calculated for the device with different channel length ( L ) and the thickness of silicon film ( T_ si) . Based on our two-dimensional density gradient simulation, it is found that, to maintain optimal device characteristics and suppress short channel effects (SCEs) for nanoscale DG MOSFETs,  T_ si should be simultaneously scaled down with respect to L . From a practical fabrication point-of-view, a DG MOSFET with ultrathin  T_ si will suppress the SCE, but suffers the fabrication process and on-state current issues. Simulation results suggest that  L/ T_ si \\geq 1 may provide a good alternative in eliminating SCEs of double-gate-based nanodevices.
Keywords :
Adaptive computation; channel length; density gradient drift-diffusion model; double-gate MOSFET; drain-induced barrier height lowering; numerical simulation; on/off current ratio; quantum correction transport model; sub 10 nm; subthreshold swing; system-on-a-chip (SOC); thickness of silicon film; threshold voltage; very large scale integration (VLSI); Circuits; Computational modeling; Electric variables; Fabrication; MOSFETs; Nanoscale devices; Quantum computing; Semiconductor films; Silicon; Threshold voltage; Adaptive computation; channel length; density gradient drift-diffusion model; double-gate MOSFET; drain-induced barrier height lowering; numerical simulation; on/off current ratio; quantum correction transport model; sub 10 nm; subthreshold swing; system-on-a-chip (SOC); thickness of silicon film; threshold voltage; very large scale integration (VLSI);
fLanguage :
English
Journal_Title :
Nanotechnology, IEEE Transactions on
Publisher :
ieee
ISSN :
1536-125X
Type :
jour
DOI :
10.1109/TNANO.2005.851440
Filename :
1504726
Link To Document :
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