• DocumentCode
    1159277
  • Title

    Application of asymptotic waveform evaluation to eigenmode expansion method for analysis of simultaneous switching noise in printed circuit boards (PCBs)

  • Author

    Liu, Ping ; Li, Zheng-Fan ; Han, Guo-Bing

  • Author_Institution
    Shanghai Jiao Tong Univ.
  • Volume
    48
  • Issue
    3
  • fYear
    2006
  • Firstpage
    485
  • Lastpage
    492
  • Abstract
    In this paper, the asymptotic waveform evaluation (AWE) technique is first applied to the conventional eigenmode expansion method for characterizing a power/ground (P/G) plane pair and analyzing the simultaneous switching noise on such plane pairs for printed circuit boards or multichip modules. The application of AWE avoids a large number of iterations in computing the impedance frequency response of a P/G plane pair structure and greatly reduces the computation time. Meanwhile, to obtain an accurate solution in an entire frequency range, we employ the complex frequency hopping technique which can help select multiple expansion points. In addition, the proposed approach can also be used to characterize the P/G plane pair structures with irregular shapes. Three examples demonstrate its high efficiency and good accuracy
  • Keywords
    circuit noise; eigenvalues and eigenfunctions; frequency response; multichip modules; printed circuits; waveform analysis; asymptotic waveform evaluation technique; complex frequency hopping technique; eigenmode expansion method; impedance frequency response; irregular shapes; multichip modules; multiple expansion points; power-ground plane pair; printed circuit boards; simultaneous switching noise; Circuit noise; Electromagnetic interference; Frequency estimation; Frequency response; Impedance; Multi-stage noise shaping; Multichip modules; Printed circuits; Shape; Switching circuits; Asymptotic waveform evaluation; complex frequency hopping; eigenmode expansion method; power/ground plane pair; simultaneous switching noise;
  • fLanguage
    English
  • Journal_Title
    Electromagnetic Compatibility, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9375
  • Type

    jour

  • DOI
    10.1109/TEMC.2006.879334
  • Filename
    1677782