• DocumentCode
    1159531
  • Title

    Application of recursive convolution to transient simulation of interconnects using a hybrid phase-pole macromodel

  • Author

    Hu, Tao ; Zhong, Bing ; Dvorak, Steven L. ; L, J.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Arizona, Tucson, AZ, USA
  • Volume
    27
  • Issue
    4
  • fYear
    2004
  • Firstpage
    603
  • Lastpage
    610
  • Abstract
    A hybrid phase-pole macromodel (HPPM), which explicitly includes phase shifts (time delays) in addition to the system poles, was recently developed for modeling interconnects. In this paper, the HPPM is applied to the transient simulation of interconnects. First, the time-domain source waveform is expanded in terms of triangular expansion functions. Knowledge of the triangle impulse response (TIR) for an interconnect, which is represented in the form of an HPPM, then allows for the time domain simulation of the interconnect. A recursive convolution algorithm is adopted to carry out the required convolutions efficiently in the transient simulator. Combining this transient simulator with an HPPM extractor yields a transient interconnect signal analysis tool.
  • Keywords
    circuit simulation; convolution; integrated circuit design; integrated circuit interconnections; poles and zeros; time-domain analysis; transient response; waveform analysis; hybrid phase-pole macromodel; interconnect signal analysis tool; interconnects; phase shifts; recursive convolution algorithm; system poles; time delays; time-domain source waveform; transient simulation; triangle impulse response; triangular expansion functions; Circuit simulation; Convolution; Delay effects; Function approximation; Integrated circuit interconnections; Power system transients; Time domain analysis; Transient analysis; Transmission line discontinuities; Transmission lines; 65; Hybrid phase-pole macromodel; interconnect modeling; time domain convolution; transmission line; triangle impulse response;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2004.831852
  • Filename
    1356003