• DocumentCode
    1159962
  • Title

    Control of Threshold Voltage of AlGaN/GaN HEMTs by Fluoride-Based Plasma Treatment: From Depletion Mode to Enhancement Mode

  • Author

    Cai, Yong ; Zhou, Yugang ; Lau, Kei May ; Chen, Kevin J.

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon
  • Volume
    53
  • Issue
    9
  • fYear
    2006
  • Firstpage
    2207
  • Lastpage
    2215
  • Abstract
    This paper presents a method with an accurate control of threshold voltages (Vth) of AlGaN/GaN high-electron mobility transistors (HEMTs) using a fluoride-based plasma treatment. Using this method, the Vth of AlGaN/GaN HEMTs can be continuously shifted from -4 V in a conventional depletion-mode (D-mode) AlGaN/GaN HEMT to 0.9 V in an enhancement-mode AlGaN/GaN HEMT. It was found that the plasma-induced damages result in a mobility degradation of two-dimensional electron gas. The damages can be repaired and the mobility can be recovered by a post-gate annealing step at 400 degC. At the same time, the shift in Vth shows a good thermal stability and is not affected by the post-gate annealing. The enhancement-mode HEMTs show a performance (transconductance, cutoff frequencies) comparable to the D-mode HEMTs. Experimental results confirm that the threshold-voltage shift originates from the incorporation of F ions in the AlGaN barrier. In addition, the fluoride-based plasma treatment was also found to be effective in lowering the gate-leakage current, in both forward and reverse bias regions. A physical model of the threshold voltage is proposed to explain the effects of the fluoride-based plasma treatment on AlGaN/GaN HEMTs
  • Keywords
    III-V semiconductors; aluminium compounds; carrier mobility; gallium compounds; high electron mobility transistors; rapid thermal annealing; semiconductor device models; two-dimensional electron gas; voltage control; wide band gap semiconductors; 0.9 V; 400 C; AlGaN-GaN; HEMT; RTA; depletion mode; enhancement mode; fluoride-based plasma treatment; gate-leakage current reduction; high-electron mobility transistors; immobile negative charge; mobility degradation; plasma-induced damages; post-gate annealing; rapid thermal annealing; threshold voltage control; Aluminum gallium nitride; Annealing; Electron mobility; Gallium nitride; HEMTs; MODFETs; Plasma stability; Thermal degradation; Threshold voltage; Voltage control; AlGaN/GaN; depletion mode (D-mode); enhancement mode; fluoride; gate current; high-electron mobility transistor (HEMT); immobile negative charge; plasma treatment; post-gate rapid thermal annealing (RTA); threshold voltage;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2006.881054
  • Filename
    1677855