The Effect of Spacer Thicknesses on Si-Based Resonant Interband Tunneling Diode Performance and Their Application to Low-Power Tunneling Diode SRAM Circuits

Si-based resonant interband tunneling diodes (RITD) with spacer thicknesses varying from 1 to 16 nm were grown and fabricated. The effect of spacer thickness on the peak-to-valley current ratio (PVCR), peak current density J_p, and voltage swing was studied. By increasing the tunneling spacer thickness up to 16 nm, RITDs with a J _p of as low as 20 mA/cm² with an associated PVCR of 1.6 were obtained, which are suitable for low-power tunnel diode SRAM applications. With the previously reported highest RITD J_p of 218 kA/cm², a J_p spanning nearly seven orders of magnitude can be obtained by engineering the tunneling spacer thickness and doping densities, thus demonstrating tremendous flexibility to optimize J_p for different circuit applications (logic, memory, and mixed-signal). Using a low-current-density RITD developed in this paper, a bread-boarded one-transistor tunneling-based SRAM (TSRAM) memory cell with low standby power consumption was demonstrated. This is the first report of a Si-based TSRAM memory circuit using Si-based RITDs. The result demonstrates the potential of Si-based tunnel diodes for low-power memory applications