• DocumentCode
    1160166
  • Title

    Determination of Diffusion Lengths With the Use of EBIC From a Diffused Junction With Any Values of Junction Depths

  • Author

    Kurniawan, Oka ; Ong, Vincent K.S.

  • Author_Institution
    Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore
  • Volume
    53
  • Issue
    9
  • fYear
    2006
  • Firstpage
    2358
  • Lastpage
    2363
  • Abstract
    Minority carrier diffusion lengths determine the performance of bipolar and photodiode devices. An electron-beam- induced-current (EBIC) method has been widely used to extract this parameter. The extraction of the diffusion lengths involves a p-n junction to collect the minority carriers. The most used configuration, which is called the normal collector, assumes that the junction has an infinitely large junction depth. However, in planar devices, the junction depth is comparable to the diffusion lengths of the material. This paper presents a simple and yet accurate method to determine the diffusion lengths of the material from a diffused junction with any values of junction depths. The diffusion length of the material is extracted from the negative reciprocal of the slope of the EBIC profile in semi-logarithmic plot. It was found that the proposed method is able to extract the diffusion lengths accurately for any values of the junction depths and surface recombination velocities. The maximum error in using this method is about 6%
  • Keywords
    EBIC; carrier lifetime; p-n junctions; photodiodes; scanning electron microscopy; surface recombination; EBIC; bipolar devices; carrier diffusion lengths; diffused junction; electron microscopy; electron-beam applications; electron-beam-induced-current method; junction depths; p-n junction; photodiode devices; semi-logarithmic plot; semiconductor material measurements; surface recombination velocities; Electron microscopy; Equations; Helium; P-n junctions; Photodiodes; Radiative recombination; Scanning electron microscopy; Semiconductor materials; Spontaneous emission; Surface fitting; Electron-beam applications; electron microscopy; semiconductor material measurements; simulation;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2006.880837
  • Filename
    1677875