DocumentCode
1160166
Title
Determination of Diffusion Lengths With the Use of EBIC From a Diffused Junction With Any Values of Junction Depths
Author
Kurniawan, Oka ; Ong, Vincent K.S.
Author_Institution
Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore
Volume
53
Issue
9
fYear
2006
Firstpage
2358
Lastpage
2363
Abstract
Minority carrier diffusion lengths determine the performance of bipolar and photodiode devices. An electron-beam- induced-current (EBIC) method has been widely used to extract this parameter. The extraction of the diffusion lengths involves a p-n junction to collect the minority carriers. The most used configuration, which is called the normal collector, assumes that the junction has an infinitely large junction depth. However, in planar devices, the junction depth is comparable to the diffusion lengths of the material. This paper presents a simple and yet accurate method to determine the diffusion lengths of the material from a diffused junction with any values of junction depths. The diffusion length of the material is extracted from the negative reciprocal of the slope of the EBIC profile in semi-logarithmic plot. It was found that the proposed method is able to extract the diffusion lengths accurately for any values of the junction depths and surface recombination velocities. The maximum error in using this method is about 6%
Keywords
EBIC; carrier lifetime; p-n junctions; photodiodes; scanning electron microscopy; surface recombination; EBIC; bipolar devices; carrier diffusion lengths; diffused junction; electron microscopy; electron-beam applications; electron-beam-induced-current method; junction depths; p-n junction; photodiode devices; semi-logarithmic plot; semiconductor material measurements; surface recombination velocities; Electron microscopy; Equations; Helium; P-n junctions; Photodiodes; Radiative recombination; Scanning electron microscopy; Semiconductor materials; Spontaneous emission; Surface fitting; Electron-beam applications; electron microscopy; semiconductor material measurements; simulation;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2006.880837
Filename
1677875
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