DocumentCode
1160175
Title
Dielectric modeling of polyimide exposed to environmental stress
Author
Wu, Shien-Yang ; Denton, Denice D.
Author_Institution
Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
Volume
27
Issue
2
fYear
1992
fDate
4/1/1992 12:00:00 AM
Firstpage
362
Lastpage
373
Abstract
The effects of high temperature and humidity exposure on the complex permittivity of PMDA-ODA polyimide (PI) are reported. The dielectric properties of a Cr-PI-Cr capacitor are measured over a frequency range from 12 Hz to 100 kHz for ambient relative humidity (RH) values from 5 to 85% RH (at room temperature). The capacitor is then aged at 85°C/85% RH for six weeks. A low-frequency dispersion in the capacitance and dissipation factor of the aged devices is observed. In addition, there is a low-frequency loss peak at high humidity values after aging that was not observed in the virgin device. The observed changes in the dielectric behavior after aging are not fully reversible via annealing at the cure temperature, though the dispersion is somewhat reduced. The authors propose a modified Debye model with two relaxation times, and its dual lumped parameter circuit model which includes a parallel conductance for the frequency response of PI films before and after aging at 85°C/85% RH. The model shows good agreement with the experimental observations
Keywords
ageing; capacitors; chromium; dielectric properties of solids; permittivity; polymers; 12 Hz to 100 kHz; 85 degC; Debye model; PMDA-ODA polyimide; aging; ambient relative humidity; annealing; complex permittivity; dielectric behavior; dissipation factor; dual lumped parameter circuit model; environmental stress; humidity exposure; low-frequency dispersion; low-frequency loss peak; parallel conductance; temperature; Aging; Capacitance; Capacitors; Dielectric measurements; Frequency measurement; Humidity measurement; Permittivity measurement; Polyimides; Stress; Temperature distribution;
fLanguage
English
Journal_Title
Electrical Insulation, IEEE Transactions on
Publisher
ieee
ISSN
0018-9367
Type
jour
DOI
10.1109/14.135607
Filename
135607
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