• DocumentCode
    1160175
  • Title

    Dielectric modeling of polyimide exposed to environmental stress

  • Author

    Wu, Shien-Yang ; Denton, Denice D.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
  • Volume
    27
  • Issue
    2
  • fYear
    1992
  • fDate
    4/1/1992 12:00:00 AM
  • Firstpage
    362
  • Lastpage
    373
  • Abstract
    The effects of high temperature and humidity exposure on the complex permittivity of PMDA-ODA polyimide (PI) are reported. The dielectric properties of a Cr-PI-Cr capacitor are measured over a frequency range from 12 Hz to 100 kHz for ambient relative humidity (RH) values from 5 to 85% RH (at room temperature). The capacitor is then aged at 85°C/85% RH for six weeks. A low-frequency dispersion in the capacitance and dissipation factor of the aged devices is observed. In addition, there is a low-frequency loss peak at high humidity values after aging that was not observed in the virgin device. The observed changes in the dielectric behavior after aging are not fully reversible via annealing at the cure temperature, though the dispersion is somewhat reduced. The authors propose a modified Debye model with two relaxation times, and its dual lumped parameter circuit model which includes a parallel conductance for the frequency response of PI films before and after aging at 85°C/85% RH. The model shows good agreement with the experimental observations
  • Keywords
    ageing; capacitors; chromium; dielectric properties of solids; permittivity; polymers; 12 Hz to 100 kHz; 85 degC; Debye model; PMDA-ODA polyimide; aging; ambient relative humidity; annealing; complex permittivity; dielectric behavior; dissipation factor; dual lumped parameter circuit model; environmental stress; humidity exposure; low-frequency dispersion; low-frequency loss peak; parallel conductance; temperature; Aging; Capacitance; Capacitors; Dielectric measurements; Frequency measurement; Humidity measurement; Permittivity measurement; Polyimides; Stress; Temperature distribution;
  • fLanguage
    English
  • Journal_Title
    Electrical Insulation, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9367
  • Type

    jour

  • DOI
    10.1109/14.135607
  • Filename
    135607