A Highly Sensitive Bolometer Structure With an Electrostatic-Actuated Signal Bridge

Author

Kim, Tae-Sik ; Lee, Hee Chul

Author_Institution

Dept. of Electr. Eng. & Comput. Sci., Korea Adv. Inst. of Sci. & Technol., Daejeon

Volume

53

Issue

9

fYear

2006

Firstpage

2392

Lastpage

2400

Abstract

A novel bolometer structure has been proposed to achieve high detectivity. The detectivity is inversely proportional to the thermal conductance of a bolometer, and most of the thermal conductance is due to a metal wire, the placement of which is necessary for the reading of a signal. However, the thermal conductance of the proposed bolometer was unaffected by the thermal conductance of a metal wire. This is because a movable signal bridge was employed to lower the thermal conductance, thereby yielding a thermal conductance of 4.13times10^-8 W/K. A measured detectivity of up to 4.23times10⁹ cmmiddotHz^1/2/W was attained at room temperature

Keywords

bolometers; electric admittance; electrostatic actuators; infrared detectors; micromechanical devices; wires (electric); actuators; electrostatic-actuated signal bridge; highly sensitive bolometer structure; infrared detectors; metal wire; microelectromechanical devices; movable signal bridge; thermal conductance; Bolometers; Bridge circuits; Conducting materials; Inorganic materials; Leg; RLC circuits; Resistors; Temperature sensors; Thermal conductivity; Wire; Actuators; bolometers; infrared detectors; microelectromechanical devices; stress;

fLanguage

English

Journal_Title

Electron Devices, IEEE Transactions on

Publisher

ieee

ISSN

0018-9383

Type

jour

DOI

10.1109/TED.2006.880826

Filename

1677880