Title :
A cool package for the 90s
Author :
Knudsen, Arne K. ; Garrou, Phillip E.
Author_Institution :
Electron. Ceramics & Adv. Mater. Group, Dow Chem. Co., Midland, MI, USA
Abstract :
Ceramic packaging offers a variety of properties that may be essential for the reliable operation of critical devices. Aluminum nitride, a relatively new and intriguing ceramic, may ultimately provide the best solution for a wide variety of electronic packaging tasks. Indeed, AlN-based packages have reached the marketplace. One obstacle remains, however: its relatively high cost.<>
Keywords :
aluminium compounds; ceramics; packaging; AlN; aluminum nitride; ceramic packaging; cost; critical devices; electronic packaging; Aluminum nitride; Aluminum oxide; Ceramics; Conducting materials; Costs; Dielectric substrates; Electronic packaging thermal management; Electronics packaging; Metallization; Thermal conductivity;
Journal_Title :
Circuits and Devices Magazine, IEEE
