Title :
Multi-layer thin-film substrates for multi-chip packaging
Author :
Chao, Clinton C. ; Scholz, Kenneth D. ; Leibovitz, Jacques ; Cobarruviaz, Maria ; Chang, Cheng C.
Author_Institution :
Hewlett-Packard Co., Palo Alto, CA, USA
fDate :
6/1/1989 12:00:00 AM
Abstract :
It is commonly recognized that multiple chip module (MCM) packaging offers great advantages in system performance by virtue of the elimination of an entire level of interconnection. Multilayer thin-film module technologies for high-performance multiple chip packaging were developed and integrated. The technologies, which feature four copper layers, polyimide dielectric, controlled-impedance transmission lines, and solder bump assembly, were demonstrated on a variety of vehicles including, recently, a 4-kbyte RAM module operating at above 100-MHz clock frequency. The generic MCM substrate technology is described. The process can be designed to be compatible with a number of substrate materials as required for specific applications
Keywords :
VLSI; hybrid integrated circuits; integrated circuit technology; modules; packaging; polymer films; random-access storage; thin film circuits; 100 MHz; 4 kbyte; Cu layers; MCM; clock frequency; controlled-impedance transmission lines; generic MCM substrate technology; high-performance multiple chip packaging; level of interconnection elimination; multi-chip packaging; multilayer thin film module; multilayer thin film substrates; multiple chip module; polyimide dielectric; solder bump assembly; substrate materials; system performance; Assembly; Copper; Dielectric substrates; Dielectric thin films; Nonhomogeneous media; Packaging; Polyimides; System performance; Transistors; Transmission lines;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
