DocumentCode :
1161437
Title :
A thick-film coplanar probe for time domain measurements
Author :
Muthukrishnan, Narayanamoorthy ; Riad, Sedki M. ; Elshabini-Riad, A.
Author_Institution :
Dept. of Electr. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
Volume :
12
Issue :
2
fYear :
1989
fDate :
6/1/1989 12:00:00 AM
Firstpage :
297
Lastpage :
302
Abstract :
The design, fabrication, and characterization of coplanar probes are presented. The probes are designed to work as launchers/adapters for performing wideband microwave measurements on planar geometry lines. The probes are made in the form of tapered coplanar lines, fabricated on alumina, teflon, and teflon-ceramic composite substrates. The time-domain reflectometry (TDR) technique was used to characterize the probes. Equivalent networks for the probes are developed using the modified transient circuit analysis program (MTCAP) by fitting a simulated TDR response to the measured TDR waveform and using a circuit simulation program (e.g. SPICE) to analyze the obtained equivalent network. The equivalent network of the probe thus obtained can then be used to de-embed the probe´s contribution to a wideband microwave measurement, and thereby reducing measurement errors
Keywords :
microwave measurement; probes; thick film devices; time-domain reflectometry; waveguide components; Al2O3 substrates; CPW; TDR; alumina; characterization; design; equivalent network; fabrication; measurement errors; planar geometry lines; tapered coplanar lines; teflon; teflon-ceramic composite substrates; thick-film coplanar probe; time domain measurements; time-domain reflectometry; wideband microwave measurements; Circuit simulation; Fabrication; Geometry; Microwave measurements; Performance evaluation; Probes; Thickness measurement; Time domain analysis; Time measurement; Wideband;
fLanguage :
English
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
0148-6411
Type :
jour
DOI :
10.1109/33.31436
Filename :
31436
Link To Document :
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