Title :
Three-dimensional waveguide arrays for coupling between fiber-optic connectors and surface-mounted optoelectronic devices
Author :
Hiramatsu, Seiki ; Kinoshita, Masao
Author_Institution :
Electron. Syst. Integration Technol. Res. Dev., Tokyo, Japan
Abstract :
This paper describes the fabrication of novel surface-mountable waveguide connectors and presents test results for them. To ensure more highly integrated and low-cost fabrication, we propose new three-dimensional (3-D) waveguide arrays that feature two-dimensionally integrated optical inputs/outputs and optical path redirection. A wafer-level stack and lamination process was used to fabricate the waveguide arrays. Vertical-cavity surface-emitting lasers (VCSELs) and photodiodes were directly mounted on the arrays and combined with mechanical transferable ferrule using active alignment. With the help of a flip-chip bonder, the waveguide connectors were mounted on a printed circuit board by solder bumps. Using mechanical transferable connectors, which can easily plug into the waveguide connectors, we obtained multi-gigabits-per-second transmission performance.
Keywords :
flip-chip devices; integrated optics; integrated optoelectronics; optical arrays; optical couplers; optical fabrication; optical fibre couplers; optical testing; optical waveguides; photodiodes; semiconductor lasers; surface emitting lasers; VCSEL; fiber-optic connectors; flip-chip bonder; integrated optical inputs/outputs; lamination; mechanical transferrable ferrule; multigigabits-per-second transmission; optical path redirection; optical waveguide connector fabrication; photodiodes; surface-mounted optoelectronic devices; three-dimensional waveguide arrays; vertical-cavity surface-emitting laser; wafer-level stack; Connectors; Integrated optics; Optical arrays; Optical device fabrication; Optical fiber devices; Optical surface waves; Optical waveguides; Optoelectronic devices; Surface waves; Vertical cavity surface emitting lasers; Mechanically transferable (MT) connector; surface-mount technology (SMT); three-dimensional (3-D) waveguide array; wafer stack and lamination; waveguide connector;
Journal_Title :
Lightwave Technology, Journal of
DOI :
10.1109/JLT.2005.853154