• DocumentCode
    1163439
  • Title

    A Novel Method of Active Power Noise Cancellation in I/O Buffers

  • Author

    Garmatyuk, Dmitriy ; Martwick, Andrew

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Miami Univ., Oxford, OH
  • Volume
    32
  • Issue
    1
  • fYear
    2009
  • Firstpage
    26
  • Lastpage
    34
  • Abstract
    This paper presents a scheme to reduce the on-die voltage noise that occurs due a buffer switching event. Both output and input buffer switch events are addressed. A generic power delivery network (PDN) model with parasitic inductance is assumed. A change in current ( di/dt) across the inductor is considered the primary cause of the voltage noise. On-die decoupling capacitance is traditionally added to the power delivery network to address this problem and to limit the droop. The method described in the paper shows a principally different approach. The maximum di/dt is managed to reduce the voltage noise. It is proposed to send to a buffer a current waveform from an external supply or to recycle charge from a locally charged capacitance when the di/dt occurs, thus substantially reducing the on-die voltage noise. Alternatively, at a given acceptable level of voltage noise the on-die capacitance can be reduced, providing significantly lower product cost. This paper provides theoretical and modeling background of the proposed schemes and includes simulation results on several performance characteristics.
  • Keywords
    buffer circuits; circuit switching; integrated circuit noise; integrated circuit packaging; power convertors; I-O buffers; active power noise cancellation; input buffer switch; on-die decoupling capacitance; on-die voltage noise; output buffer switch; parasitic inductance; power delivery network model; voltage droops; voltage noise; Costs; Inductance; Inductors; Noise cancellation; Noise level; Noise reduction; Parasitic capacitance; Recycling; Switches; Voltage; Decoupling of systems; integrated circuit noise; interconnections; noise;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2008.2010775
  • Filename
    4785110