DocumentCode :
1163489
Title :
New Considerations About Stability Margins of NbTi Cable in Conduit Conductors
Author :
Duchateau, J.L.
Author_Institution :
CEA Cadarache Assoc., EURATOM-CEA CEA/ DSM/IRFM, St. Paul lez Durance
Volume :
19
Issue :
2
fYear :
2009
fDate :
4/1/2009 12:00:00 AM
Firstpage :
55
Lastpage :
62
Abstract :
The design of NbTi cable in conduit conductors (CICCs) according to the criterion of the limiting current often leads to high copper content, with a Cu/nonCu ratio inside the multifilamentary composites in the range of 6 to 8. This high copper content makes NbTi multifilamentary composites difficult and expensive to manufacture, especially if the required filament diameter is in the range of 5-10 mum. Moreover, a detailed analysis of the cable in conduit stability for expected disturbances or heat deposition on a long length of conductor shows that copper plays, in practice, no role in the case where current is uniformly distributed. An analytical approach is given to demonstrate this statement and propose a cheaper and reliable method to identify the drivers of the stability margins. Certainly copper is needed in large amounts for protection, but this copper can be segregated in dedicated strands. Typical copper content of 60% to 70% in the strands is sufficient for intrinsic dynamic stability and to stabilize the CICC against short mechanical disturbances in the range of 1 ms for the time constant affecting short lengths of CICC (10 mm). Stability issues in NbTi CICCs might also be linked to current distribution effects where contact resistance between strands plays a leading role.
Keywords :
copper; electric conduits; multifilamentary superconductors; niobium compounds; stability; cable; conduit conductors; conduit stability; copper content; heat deposition; intrinsic dynamic stability; limiting current; multifilamentary composites; stability margins; Stability; Stekly criterion; cable in conduit; copper segregation; heat transfer; helium;
fLanguage :
English
Journal_Title :
Applied Superconductivity, IEEE Transactions on
Publisher :
ieee
ISSN :
1051-8223
Type :
jour
DOI :
10.1109/TASC.2009.2012723
Filename :
4785116
Link To Document :
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