DocumentCode :
1163936
Title :
Analytical Model for Optimum Signal Integrity in PCB Interconnects Using Ground Tracks
Author :
Sharma, Rohit ; Chakravarty, Tapas ; Bhattacharyya, Amalendu Bhushan
Author_Institution :
Jaypee Univ. of Inf. Technol., Solan
Volume :
51
Issue :
1
fYear :
2009
Firstpage :
67
Lastpage :
77
Abstract :
In this paper, we present analytical models for line impedance and the coupling coefficient in the presence of additional ground tracks. We use a variational analysis combined with the transverse transmission-line technique to model interconnect lines guarded by ground tracks. Using the proposed model, it would be possible for designers to reduce crosstalk in coupled lines and obtain desired line impedance, thereby ensuring optimum signal integrity. The results obtained are verified by full-wave simulations and measurements performed on a vector network analyzer. The proposed model may find applications in the design and analysis of high-speed interconnects.
Keywords :
crosstalk; network analysers; printed circuits; transmission lines; PCB interconnects; coupling coefficient; ground tracks; line impedance; optimum signal integrity; printed circuit board; transverse transmission-line technique; vector network analyzer; Analytical models; Crosstalk; Finite difference methods; Impedance; Integrated circuit interconnections; Microstrip; Performance evaluation; Signal design; Time domain analysis; Transmission lines; Crosstalk; finite-difference time-domain (FDTD); ground tracks; printed circuit board (PCB) interconnects; signal integrity; variational analysis;
fLanguage :
English
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9375
Type :
jour
DOI :
10.1109/TEMC.2008.2010054
Filename :
4785161
Link To Document :
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