Optoelectronic and microwave characteristics of silver coated indium bumps for low temperature flip-chip applications

Author

Chu, K.-M. ; Choi, J.-H. ; Lee, J.-S. ; Cho, H.S. ; Park, S.-O. ; Park, H.-H. ; Jeon, D.Y.

Author_Institution

Dept. of Mater. Sci. & Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea

Volume

40

Issue

23

fYear

2004

Firstpage

1508

Lastpage

1509

Abstract

The effect of silver coating on pure indium bumps for low temperature and high speed flip-chip applications is presented with respect to optoelectronic and microwave characteristics. The current-voltage and light power-current characteristics of flip-chip bonded vertical-cavity surface-emitting laser (VCSEL) arrays are improved by coating a thin silver layer of 0.2 /spl mu/m. The flip-chip assembled coplanar waveguide packages using silver coated bumps show the insertion loss is about 3.3 dB/cm at 20 GHz and the return loss is under 13 dB.

Keywords

chip scale packaging; coplanar waveguides; flip-chip devices; indium; integrated circuit interconnections; laser arrays; microwave devices; silver; surface emitting lasers; 0.2 micron; 20 GHz; Ag-In; coplanar waveguide packages; current-voltage curves; flip-chip assembled packages; high speed flip-chip applications; insertion loss; low temperature flip-chip applications; microwave properties; optoelectronic properties; power-current curves; silver coated indium bumps; vertical cavity surface emitting laser arrays;

fLanguage

English

Journal_Title

Electronics Letters

Publisher

iet

ISSN

0013-5194

Type

jour

DOI

10.1049/el:20046619

Filename

1358968