• DocumentCode
    1164409
  • Title

    Superresolved Imaging of Microelectronic Devices for Improved Failure Analysis

  • Author

    Gur, Eran ; Weizman, Yoav ; Zalevsky, Zeev

  • Author_Institution
    Shenkar Coll. of Eng. & Design, Ramat-Gan
  • Volume
    9
  • Issue
    2
  • fYear
    2009
  • fDate
    6/1/2009 12:00:00 AM
  • Firstpage
    209
  • Lastpage
    214
  • Abstract
    In this paper, we present a new numerical approach for improving the resolving power of low-resolution (LR) images. This approach may be applied for failure analysis of microelectronic chips. The resolution improvement is based upon numerical iterative comparison between a LR experimentally captured image and a high-resolution layout image of the same region of interest.
  • Keywords
    failure analysis; image resolution; integrated circuits; failure analysis; high-resolution layout image; low-resolution image resolving power improvement; microelectronic chip; microelectronic device; superresolved algorithm; Circuit analysis; failure analysis; image processing; image resolution;
  • fLanguage
    English
  • Journal_Title
    Device and Materials Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1530-4388
  • Type

    jour

  • DOI
    10.1109/TDMR.2008.2012056
  • Filename
    4785211
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1164409