Title :
Superresolved Imaging of Microelectronic Devices for Improved Failure Analysis
Author :
Gur, Eran ; Weizman, Yoav ; Zalevsky, Zeev
Author_Institution :
Shenkar Coll. of Eng. & Design, Ramat-Gan
fDate :
6/1/2009 12:00:00 AM
Abstract :
In this paper, we present a new numerical approach for improving the resolving power of low-resolution (LR) images. This approach may be applied for failure analysis of microelectronic chips. The resolution improvement is based upon numerical iterative comparison between a LR experimentally captured image and a high-resolution layout image of the same region of interest.
Keywords :
failure analysis; image resolution; integrated circuits; failure analysis; high-resolution layout image; low-resolution image resolving power improvement; microelectronic chip; microelectronic device; superresolved algorithm; Circuit analysis; failure analysis; image processing; image resolution;
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
DOI :
10.1109/TDMR.2008.2012056
