Title :
PLC-based 1.3/1.49/1.55 μm WDM transceiver with modular structure using chip-scale-packaged OE devices
Author :
Nakanishi, Y. ; Hirota, H. ; Watanabe, K. ; Hashizume, Y. ; Ogawa, I. ; Ishii, M. ; Kohtoku, M. ; Yanagisawa, M. ; Endo, J. ; Kurosaki, T. ; Inoue, Y.
Author_Institution :
NTT Photonics Labs., NTT Corp., Atsugi, Japan
fDate :
7/20/2006 12:00:00 AM
Abstract :
A novel modular structure to improve the fabrication yield and reliability of hybrid-integrated planar lightwave circuit modules is presented. A chip-scale packaging technique for optoelectronic devices has been developed, and a 1.3/1.49/1.55 μm optical WDM transceiver module as a key component has been successfully fabricated.
Keywords :
chip scale packaging; integrated optoelectronics; optical communication equipment; reliability; transceivers; wavelength division multiplexing; 1.3 micron; 1.49 micron; 1.55 micron; PLC; WDM transceiver; chip-scale packaging; fabrication reliability; fabrication yield; hybrid-integrated planar lightwave circuit modules; modular structure; optoelectronic devices;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:20061720
