Title :
Simulation by ballistic deposition of local density variation and step coverage for via metallization
Author :
Westra, K.L. ; Smy, T. ; Brett, Michael J.
Author_Institution :
Dept. of Electr. Eng., Alberta Univ., Edmonton, Alta., Canada
fDate :
5/1/1989 12:00:00 AM
Abstract :
The simulation is presented of ballistic deposition of sputtered metal deposited over a via. The step coverage of the film is determined and surface profiles provided at different film thicknesses. The use of a ballistic deposition technique provides additional information unattainable through the use of conventional film deposition simulations. A density profile of the film is produced and the columnar microstructure analyzed.<>
Keywords :
metallic thin films; metallisation; sputtered coatings; surface topography; ballistic deposition; columnar microstructure; film density profile; film thicknesses; local density variation; simulation; sputtered metal; step coverage; surface profiles; via metallization; Atomic layer deposition; Atomic measurements; Metallization; Microstructure; Semiconductor process modeling; Shadow mapping; Sputtering; Substrates; Surface topography; Very large scale integration;
Journal_Title :
Electron Device Letters, IEEE
