Title :
Millimeter Wave Substrate Integrated Waveguide Antennas: Design and Fabrication Analysis
Author :
Henry, M. ; Free, C.E. ; Izqueirdo, B.S. ; Batchelor, J. ; Young, P.
Author_Institution :
Adv. Technol. Inst., Univ. of Surrey, Guildford
Abstract :
The paper presents a new concept in antenna design, whereby a photo-imageable thick-film process is used to integrate a waveguide antenna within a multilayer structure. This has yielded a very compact, high performance antenna working at high millimeter-wave (mm-wave) frequencies, with a high degree of repeatability and reliability in antenna construction. Theoretical and experimental results for 70 GHz mm-wave integrated antennas, fabricated using the new technique, are presented. The antennas were formed from miniature slotted waveguide arrays using up to 18 layers of photo-imageable material. To enhance the electrical performance a novel folded waveguide array was also investigated. The fabrication process is analyzed in detail and the critical issues involved in the fabrication cycle are discussed. The losses in the substrate integrated waveguide have been calculated. The performance of the new integrated antenna is compared to conventional metallic, air-filled waveguide antennas, and also to conventional microstrip antenna arrays operating at the same frequencies.
Keywords :
microstrip antenna arrays; millimetre wave antenna arrays; substrate integrated waveguides; waveguide antenna arrays; antenna design; frequency 70 GHz; microstrip antenna arrays; millimeter wave substrate integrated waveguide antennas; photo-imageable material; photo-imageable thick-film process; Antenna arrays; Frequency; Microstrip antenna arrays; Microstrip antennas; Millimeter wave technology; Nonhomogeneous media; Optical device fabrication; Silicon carbide; Slot antennas; Space technology; Millimeter wave antenna arrays; photo-imageable fabrication; slotted waveguide antenna arrays; substrate integrated waveguides (SIW);
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/TADVP.2008.2011284