DocumentCode
1165786
Title
Architectural level test generation for microprocessors
Author
Lee, Jaushin ; Patel, Janak H.
Author_Institution
Silicon Graphics Inc., Mountain View, CA, USA
Volume
13
Issue
10
fYear
1994
fDate
10/1/1994 12:00:00 AM
Firstpage
1288
Lastpage
1300
Abstract
Hierarchically designed microprocessor-like VLSI circuits have complex data paths and embedded control machines to execute instructions. When a test pattern has to be applied to the input of an embedded module, determination of a sequence of instructions, which will apply this pattern and propagate the fault effects, is extremely difficult. After the instruction sequence is derived, to assign values at all interior lines without conflicts is also very difficult. In this paper, we propose a separation of test generation process into two phases: path analysis and value analysis. In the phase of path analysis, a new methodology for automatic assembly of a sequence of instructions is proposed to satisfy the internal test goals. In the phase of value analysis, an equation-solving algorithm is used to compute an exact value solution for all interior lines. This new ATPG methodology containing techniques for both path and value analysis forms a complete solution for a variety of microprocessor-like circuits. This new approach has been implemented and experimented on six high-level circuits. The results show that our approach is very effective in achieving complete automation for high-level test generation
Keywords
VLSI; automatic testing; computer testing; integrated circuit testing; logic testing; microprocessor chips; ATPG methodology; VLSI circuits; architectural level test generation; embedded module; equation-solving algorithm; high-level test generation; instruction sequence assembling; microprocessors; path analysis; structural data flow graph; test pattern; value analysis; Algorithm design and analysis; Assembly; Automatic test pattern generation; Automatic testing; Automation; Circuit faults; Circuit testing; Equations; Microprocessors; Very large scale integration;
fLanguage
English
Journal_Title
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher
ieee
ISSN
0278-0070
Type
jour
DOI
10.1109/43.317464
Filename
317464
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